EP3SL200H780I3 vs EP3SL200H780I4L Vergleich
Detaillierter Direktvergleich von EP3SL200H780I3 von Intel und EP3SL200H780I4L von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SL200H780I3 | EP3SL200H780I4L |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $7.980,00 | $1.395,00 |
| Series | Stratix III L | — |
| Family | Stratix III | Stratix III L |
| Logic Elements | 200,000 | 200,000 |
| LABs (Logic Array Blocks) | 8000 | — |
| Total RAM Bits | 10,901,504 (10,900 Kb) | — |
| User I/O Count | 488 | — |
| Number of I/O Banks | [DATA_NEEDED: I/O banks] | — |
| Embedded Multipliers (DSP blocks) | 384 (18x18) | — |
| PLLs | 12 | — |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Core Voltage | 1.1 V | — |
| Maximum Operating Frequency | 717 MHz | — |
| Betriebstemperatur | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Gehäuse | 780-BBGA, FCBGA (HBGA-780) | 780-pin FC-HFBGA (Flip-Chip) |
| Montageart | Surface Mount | Surface Mount |
| Supplier Device Package | 780-FBGA (29x29 mm) | — |
| Lead-Free / RoHS | Compliant (lead-free) | — |
| Logic Array Blocks (LABs) | — | 8,000 |
| Embedded Memory (Bits) | — | 10,901,504 |
| Maximum User I/O | — | 488 |
| Core Supply Voltage | — | 0.86 V to 1.15 V |
| Internal Performance | — | 375 MHz |
| Transceivers | — | Up to 24 channels |
| Transceiver Data Rate | — | Up to 6.375 Gbps |
| DSP Blocks | — | 9x9 / 18x18 / 36x36 multipliers |
| Memory Interface Support | — | DDR3, DDR2, DDR, QDR II+, RLDRAM II |
| JTAG Support | — | IEEE Std 1149.1 Boundary-Scan |
| RoHS-Status | — | Compliant |
| Speed Grade | — | I4 (Industrial) |
| HardCopy Support | — | Compatible (Lattice-style migration path via HardCopy III) |