EP3SL200H780I3 vs EP3SL200H780I4L 对比
详细并排对比 EP3SL200H780I3 出自 Intel 和 EP3SL200H780I4L 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SL200H780I3 | EP3SL200H780I4L |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $7,980.00 | $1,395.00 |
| Series | Stratix III L | — |
| Family | Stratix III | Stratix III L |
| Logic Elements | 200,000 | 200,000 |
| LABs (Logic Array Blocks) | 8000 | — |
| Total RAM Bits | 10,901,504 (10,900 Kb) | — |
| User I/O Count | 488 | — |
| Number of I/O Banks | [DATA_NEEDED: I/O banks] | — |
| Embedded Multipliers (DSP blocks) | 384 (18x18) | — |
| PLLs | 12 | — |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Core Voltage | 1.1 V | — |
| Maximum Operating Frequency | 717 MHz | — |
| 工作温度 | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| 封装 | 780-BBGA, FCBGA (HBGA-780) | 780-pin FC-HFBGA (Flip-Chip) |
| 安装类型 | Surface Mount | Surface Mount |
| Supplier Device Package | 780-FBGA (29x29 mm) | — |
| Lead-Free / RoHS | Compliant (lead-free) | — |
| Logic Array Blocks (LABs) | — | 8,000 |
| Embedded Memory (Bits) | — | 10,901,504 |
| Maximum User I/O | — | 488 |
| Core Supply Voltage | — | 0.86 V to 1.15 V |
| Internal Performance | — | 375 MHz |
| Transceivers | — | Up to 24 channels |
| Transceiver Data Rate | — | Up to 6.375 Gbps |
| DSP Blocks | — | 9x9 / 18x18 / 36x36 multipliers |
| Memory Interface Support | — | DDR3, DDR2, DDR, QDR II+, RLDRAM II |
| JTAG Support | — | IEEE Std 1149.1 Boundary-Scan |
| RoHS 状态 | — | Compliant |
| Speed Grade | — | I4 (Industrial) |
| HardCopy Support | — | Compatible (Lattice-style migration path via HardCopy III) |