EP3SL200H780I4 vs EP3SL200H780C2 Vergleich
Detaillierter Direktvergleich von EP3SL200H780I4 von Intel und EP3SL200H780C2 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SL200H780I4 | EP3SL200H780C2 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $6.255,75 | $6.950,00 |
| Series | Stratix III L | Stratix III L |
| Family | Stratix III | — |
| Logic Elements (LE) | 200,000 | — |
| Logic Array Blocks (LABs) | 8000 | — |
| Embedded Memory Bits | 10,901,504 | — |
| User I/O Count | 488 | 488 |
| DSP Multipliers (18x18) | 384 | [DATA_NEEDED: 18x18 multiplier count] |
| Voltage - Core Supply | 1.1 V | — |
| Process Technology | 65 nm CMOS | — |
| Package Type | 780-BBGA / FCBGA (FC-HFBGA) | — |
| Package Dimensions | 33 mm x 33 mm | — |
| Speed Grade | I4 (industrial) | — |
| Betriebs-Sperrschichttemperatur | -40C to +100C (industrial) | — |
| Configuration Memory | SRAM-based, volatile | — |
| RoHS-Status | Compliant | Compliant |
| Design Tool | Quartus II (legacy) / Quartus Prime | — |
| Logic Elements | — | 200,000 |
| LABs / CLBs | — | 8000 |
| Total Memory Bits | — | 10,901,504 |
| Gehäuse | — | 780-BBGA, FCBGA |
| Betriebstemperatur | — | 0C to +85C (Commercial) |
| Montageart | — | Surface Mount |
| MSL-Level | — | [DATA_NEEDED: MSL level] |
| Process Node | — | 65 nm |
| Voltage - Core | — | [DATA_NEEDED: core voltage] |
| Voltage - I/O | — | [DATA_NEEDED: I/O voltage] |
| Transceivers | — | [DATA_NEEDED: transceiver count for H780] |
| Lead Free | — | Yes |