EP3SL200H780I4L vs EP3SL200H780C4L Vergleich

Detaillierter Direktvergleich von EP3SL200H780I4L von Intel und EP3SL200H780C4L von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3SL200H780I4L EP3SL200H780C4L
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.395,00 $6.459,35
Family Stratix III L —
Logic Elements 200,000 200,000
Logic Array Blocks (LABs) 8,000 —
Embedded Memory (Bits) 10,901,504 —
Maximum User I/O 488 —
Core Supply Voltage 0.86 V to 1.15 V —
Process Technology 65 nm CMOS TSMC 40 nm
Internal Performance 375 MHz —
Gehäuse 780-pin FC-HFBGA (Flip-Chip) —
Montageart Surface Mount —
Betriebstemperatur -40C to +100C (Industrial) 0C to 85C (commercial)
Transceivers Up to 24 channels —
Transceiver Data Rate Up to 6.375 Gbps —
DSP Blocks 9x9 / 18x18 / 36x36 multipliers —
Memory Interface Support DDR3, DDR2, DDR, QDR II+, RLDRAM II —
JTAG Support IEEE Std 1149.1 Boundary-Scan —
RoHS-Status Compliant Compliant
Speed Grade I4 (Industrial) -4 (medium performance, commercial)
HardCopy Support Compatible (Lattice-style migration path via HardCopy III) —
Manufacturer — Intel (formerly Altera)
Series — Stratix III
Device Type — FPGA - Field Programmable Gate Array
Embedded Memory — 6.5 Mbit
User I/O Count — 488
Package Type — 780-ball FCBGA (FineLine BGA, HBGA)
Package Code — BGA-780 / PBGA780 / HBGA-780
Package Mounting — Surface Mount
Internal Logic Frequency — up to 717 MHz (per ampheo datasheet brief)
Lead-Free / Pb-Free — Yes (L suffix, lead-free)
Configuration Modes — FPP, AS, PS, JTAG

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern