EP3SL340F1760I3 vs EP3SL340F1760C4 Vergleich
Detaillierter Direktvergleich von EP3SL340F1760I3 von Intel und EP3SL340F1760C4 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SL340F1760I3 - Stratix III L FPGA, 337.5K LE, 1760-BGA | Intel
EP3SL340F1760I3 ⚠ Letzte BestellmöglichkeitIntel
EP3SL340F1760C4 - Stratix III L FPGA 337.5K LE | Intel | 1760-BGA
EP3SL340F1760C4 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP3SL340F1760I3 | EP3SL340F1760C4 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.450,00 | $9.750,00 |
| Series | Stratix III L | Stratix III L |
| Logic Elements | 337,500 LE | 337,500 |
| LABs (Logic Array Blocks) | 13,500 | — |
| Embedded Memory Bits | 18,822,144 bit | 18,821,144 |
| User I/Os | 1120 | — |
| Number of Pins / Balls | 1760 | — |
| Package Type | FC-FBGA (1760-ball, FineLine BGA) | — |
| Package Code | BGA1760, 42x42, 40 | — |
| Core Voltage | 1.1 V | 1.1 V |
| Process Technology | 65 nm | — |
| Betriebstemperatur | -40 °C to 100 °C (Industrial grade, I3 suffix) | 0C to +85C (commercial) |
| Speed Grade | I3 (Industrial, mid-speed bin) | C4 (commercial) |
| Montageart | Surface Mount | Surface Mount (BGA) |
| RoHS-Status | Compliant (Pb-free BGA balls) | Compliant |
| Configuration Memory | SRAM-based, volatile (requires external configuration device) | — |
| Transceivers | [DATA_NEEDED: transceiver count and data rate for this F1760 variant] | [DATA_NEEDED: number of embedded transceiver channels] |
| DSP Blocks | [DATA_NEEDED: 18x18 multiplier count] | [DATA_NEEDED: DSP block count] |
| PLLs | [DATA_NEEDED: PLL count] | [DATA_NEEDED: PLL count] |
| MSL-Level | MSL3 (JEDEC J-STD-020, reflow 245 °C peak) | — |
| User I/O Count | — | 1,120 |
| Gehäuse | — | 1760-BBGA, FCBGA (Flip-Chip) |
| Process Node | — | 65 nm |
| Maximum Core Frequency | — | 450 MHz |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, HSTL, SSTL, PCI, PCI-X |
| Configuration Scheme | — | Passive serial, fast passive parallel, JTAG |
| Lead-Free | — | Yes |