EP3SL340F1760I3 vs EP3SL340F1760C4 对比

详细并排对比 EP3SL340F1760I3 出自 Intel 和 EP3SL340F1760C4 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP3SL340F1760I3 EP3SL340F1760I3 - Stratix III L FPGA, 337.5K LE, 1760-BGA | Intel

EP3SL340F1760I3 - Stratix III L FPGA, 337.5K LE, 1760-BGA | Intel

EP3SL340F1760I3 ⚠ 最后一次采购
Intel
EP3SL340F1760C4 EP3SL340F1760C4 - Stratix III L FPGA 337.5K LE | Intel | 1760-BGA

EP3SL340F1760C4 - Stratix III L FPGA 337.5K LE | Intel | 1760-BGA

EP3SL340F1760C4 ⚠ 最后一次采购

规格对比

参数 EP3SL340F1760I3 EP3SL340F1760C4
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 最后采购期 最后采购期
库存状态 有库存 有库存
单价(USD) $1,450.00 $9,750.00
Series Stratix III L Stratix III L
Logic Elements 337,500 LE 337,500
LABs (Logic Array Blocks) 13,500 —
Embedded Memory Bits 18,822,144 bit 18,821,144
User I/Os 1120 —
Number of Pins / Balls 1760 —
Package Type FC-FBGA (1760-ball, FineLine BGA) —
Package Code BGA1760, 42x42, 40 —
Core Voltage 1.1 V 1.1 V
Process Technology 65 nm —
工作温度 -40 °C to 100 °C (Industrial grade, I3 suffix) 0C to +85C (commercial)
Speed Grade I3 (Industrial, mid-speed bin) C4 (commercial)
安装类型 Surface Mount Surface Mount (BGA)
RoHS 状态 Compliant (Pb-free BGA balls) Compliant
Configuration Memory SRAM-based, volatile (requires external configuration device) —
Transceivers [DATA_NEEDED: transceiver count and data rate for this F1760 variant] [DATA_NEEDED: number of embedded transceiver channels]
DSP Blocks [DATA_NEEDED: 18x18 multiplier count] [DATA_NEEDED: DSP block count]
PLLs [DATA_NEEDED: PLL count] [DATA_NEEDED: PLL count]
MSL 等级 MSL3 (JEDEC J-STD-020, reflow 245 °C peak) —
User I/O Count — 1,120
封装 — 1760-BBGA, FCBGA (Flip-Chip)
Process Node — 65 nm
Maximum Core Frequency — 450 MHz
I/O Standards Supported — LVDS, LVTTL, LVCMOS, HSTL, SSTL, PCI, PCI-X
Configuration Scheme — Passive serial, fast passive parallel, JTAG
Lead-Free — Yes

数据手册与资源

浏览全部产品 创建 BOM 获取报价