EP3SL50F484I3 vs EP3SE50F484I4N Vergleich

Detaillierter Direktvergleich von EP3SL50F484I3 von Intel und EP3SE50F484I4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3SL50F484I3 EP3SE50F484I4N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $701,23 $998,00
Family Stratix III L (Low Power) —
Device Logic Elements 47,500 —
Embedded Memory (bits) 2,184,192 —
Logic Array Blocks (LABs) 1,900 1,900
Maximum User I/O 296 —
Gehäuse 484-ball FC-FBGA (Flip-Chip FineLine BGA) 484-ball FC-FBGA (F484)
Process Technology 65 nm 65 nm CMOS
Core Voltage 1.1 V 1.1 V
Internal Operating Frequency 500 MHz —
Betriebstemperatur 0 °C to +85 °C (commercial) 0 C to +85 C (Industrial)
Montageart Surface Mount —
Lead-Free / RoHS [DATA_NEEDED: lead-free/RoHS status] Lead-free (per ampheo listing)
MSL-Level [DATA_NEEDED: MSL level] —
Configuration Scheme SRAM-based (volatile, requires external config device) —
Transceivers Stratix III L — supports high-speed serial transceivers per family datasheet —
Device Family — Stratix III E
Logic Elements (LE) — 47,500
Adaptive Logic Modules (ALMs) — 19,000
Embedded Memory (TriMatrix) — 2,136 Kbits
Embedded Multipliers (18x18) — 384
User I/Os — 296
I/O Banks — 12
PLLs — 8
Global Clock Networks — 16
Maximum User I/O Frequency — 800 MHz (per DigChip datasheet summary)
Speed Grade — I4

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