EP3SL70F780C3 vs EP3SL70F780C4L Vergleich

Detaillierter Direktvergleich von EP3SL70F780C3 von Intel und EP3SL70F780C4L von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3SL70F780C3 EP3SL70F780C4L
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $780,00 $944,74
Series Stratix III L Stratix III L
Family Stratix III —
Logic Elements (LE) 67,500 67,500
Embedded Memory (bits) 2,699,264 —
Logic Array Blocks (LABs) 2,700 2,700
User I/O Count 488 —
Number of I/O Banks [DATA_NEEDED: number of I/O banks] —
Number of Pins / Balls 780 —
Gehäuse 780-BBGA, FC-FBGA —
Montageart Surface Mount Surface Mount (BGA)
Process Technology 65 nm 65 nm
Core Voltage (VCCINT) 1.1 V —
Maximum Internal Clock Frequency 500 MHz —
Betriebstemperaturbereich 0°C to 85°C (commercial) —
Speed Grade C3 C4
Design Software Quartus II (last supported v13.1) Quartus II (Stratix III device support)
RoHS-Status [DATA_NEEDED: RoHS status] —
Manufacturer — Intel (formerly Altera)
Device Type — FPGA - Field Programmable Gate Array
Total Memory Bits — 2,699,264 bits (~2.7 Mb)
Maximum User I/O — 488
Internal Frequency (max) — [DATA_NEEDED: internal frequency]
Core Voltage (VCC) — 0.9 V
Betriebstemperatur — 0C to 85C (commercial)
Package Type — 780-BBGA, FC-FBGA (Flip-Chip)
Lead Free / RoHS — Yes (lead-free per BGA package)
Configuration Method — JTAG, Passive Serial, FPP, external memory

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