EP3SL70F780C3 vs EP3SL70F780C4L 对比

详细并排对比 EP3SL70F780C3 出自 Intel 和 EP3SL70F780C4L 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EP3SL70F780C3 EP3SL70F780C4L
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 不推荐新设计 不推荐新设计
库存状态 有库存 有库存
单价(USD) $780.00 $944.74
Series Stratix III L Stratix III L
Family Stratix III —
Logic Elements (LE) 67,500 67,500
Embedded Memory (bits) 2,699,264 —
Logic Array Blocks (LABs) 2,700 2,700
User I/O Count 488 —
Number of I/O Banks [DATA_NEEDED: number of I/O banks] —
Number of Pins / Balls 780 —
封装 780-BBGA, FC-FBGA —
安装类型 Surface Mount Surface Mount (BGA)
Process Technology 65 nm 65 nm
Core Voltage (VCCINT) 1.1 V —
Maximum Internal Clock Frequency 500 MHz —
工作温度范围 0°C to 85°C (commercial) —
Speed Grade C3 C4
Design Software Quartus II (last supported v13.1) Quartus II (Stratix III device support)
RoHS 状态 [DATA_NEEDED: RoHS status] —
Manufacturer — Intel (formerly Altera)
Device Type — FPGA - Field Programmable Gate Array
Total Memory Bits — 2,699,264 bits (~2.7 Mb)
Maximum User I/O — 488
Internal Frequency (max) — [DATA_NEEDED: internal frequency]
Core Voltage (VCC) — 0.9 V
工作温度 — 0C to 85C (commercial)
Package Type — 780-BBGA, FC-FBGA (Flip-Chip)
Lead Free / RoHS — Yes (lead-free per BGA package)
Configuration Method — JTAG, Passive Serial, FPP, external memory

数据手册与资源

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