EP3SL70F780I3 vs EP3SL50F780I3 Vergleich
Detaillierter Direktvergleich von EP3SL70F780I3 von Intel und EP3SL50F780I3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SL70F780I3 - 67.5K Logic Elements Stratix III L FPGA | Intel
EP3SL70F780I3 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP3SL70F780I3 | EP3SL50F780I3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.096,81 | $632,63 |
| Family | Stratix III L | — |
| Logic Elements | 67,500 | 47,500 |
| Embedded Memory Bits | 2,699,264 bits | — |
| Maximum User I/O | 488 | — |
| Betriebstemperatur | -40 C to +100 C (Industrial) | -40C to +100C (industrial) |
| Speed Grade | I3 (industrial) | I3 (industrial, third-fastest bin) |
| Core Voltage | 1.1 V | Selectable 1.1 V / 0.9 V |
| Process Node | 65 nm | — |
| Gehäuse | 780-ball FineLine BGA (FC-FBGA), 28x28 mm | 780-ball FC-FBGA (FineLine BGA), 1 mm pitch |
| Package Code | BGA780,28X28,40 | — |
| Montageart | Surface Mount | Surface Mount |
| Configuration Mode | JTAG IEEE 1149.1, Passive Serial, Active Serial | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant |
| Number of Terminals | 780 | — |
| Supplier Device Package | 780-BBGA, FCBGA | — |
| Series | — | Stratix III L |
| Logic Array Blocks (LABs) | — | 1,900 |
| User I/O Pins | — | 488 |
| Total Memory Bits | — | 2,106 Kbit (M9K + M144K) |
| Transceiver Channels | — | 16 (up to 3.75 Gbps) + 8 (up to 6.5 Gbps) |
| Process Technology | — | 65 nm |
| Lead Free | — | Yes |
| Vertical Migration | — | Drop-in to EP3SL70 in 780-FBGA package |