EP3SL70F780I3 vs EP3SL50F780I3 对比
详细并排对比 EP3SL70F780I3 出自 Intel 和 EP3SL50F780I3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SL70F780I3 | EP3SL50F780I3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 最后采购期 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,096.81 | $632.63 |
| Family | Stratix III L | — |
| Logic Elements | 67,500 | 47,500 |
| Embedded Memory Bits | 2,699,264 bits | — |
| Maximum User I/O | 488 | — |
| 工作温度 | -40 C to +100 C (Industrial) | -40C to +100C (industrial) |
| Speed Grade | I3 (industrial) | I3 (industrial, third-fastest bin) |
| Core Voltage | 1.1 V | Selectable 1.1 V / 0.9 V |
| Process Node | 65 nm | — |
| 封装 | 780-ball FineLine BGA (FC-FBGA), 28x28 mm | 780-ball FC-FBGA (FineLine BGA), 1 mm pitch |
| Package Code | BGA780,28X28,40 | — |
| 安装类型 | Surface Mount | Surface Mount |
| Configuration Mode | JTAG IEEE 1149.1, Passive Serial, Active Serial | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | Compliant |
| Number of Terminals | 780 | — |
| Supplier Device Package | 780-BBGA, FCBGA | — |
| Series | — | Stratix III L |
| Logic Array Blocks (LABs) | — | 1,900 |
| User I/O Pins | — | 488 |
| Total Memory Bits | — | 2,106 Kbit (M9K + M144K) |
| Transceiver Channels | — | 16 (up to 3.75 Gbps) + 8 (up to 6.5 Gbps) |
| Process Technology | — | 65 nm |
| Lead Free | — | Yes |
| Vertical Migration | — | Drop-in to EP3SL70 in 780-FBGA package |