EP3SL70F780I3 vs EP3SL70F780I3N Vergleich
Detaillierter Direktvergleich von EP3SL70F780I3 von Intel und EP3SL70F780I3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SL70F780I3 - 67.5K Logic Elements Stratix III L FPGA | Intel
EP3SL70F780I3 ⚠ Letzte Bestellmöglichkeit
Spezifikationsvergleich
| Parameter | EP3SL70F780I3 | EP3SL70F780I3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.096,81 | $1.240,00 |
| Family | Stratix III L | Stratix III L |
| Logic Elements | 67,500 | 67,500 |
| Embedded Memory Bits | 2,699,264 bits | — |
| Maximum User I/O | 488 | — |
| Betriebstemperatur | -40 C to +100 C (Industrial) | — |
| Speed Grade | I3 (industrial) | I3 (industrial) |
| Core Voltage | 1.1 V | 1.1 V (1.05 V to 1.15 V) |
| Process Node | 65 nm | — |
| Gehäuse | 780-ball FineLine BGA (FC-FBGA), 28x28 mm | — |
| Package Code | BGA780,28X28,40 | — |
| Montageart | Surface Mount | Surface Mount |
| Configuration Mode | JTAG IEEE 1149.1, Passive Serial, Active Serial | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant (per distributor listings) |
| Number of Terminals | 780 | — |
| Supplier Device Package | 780-BBGA, FCBGA | — |
| Logic Array Blocks (LABs) | — | 2,700 |
| Embedded Memory (bits) | — | 2,699,264 |
| User I/Os | — | 488 |
| Process Technology | — | 65 nm CMOS |
| Operating Frequency | — | 500 MHz |
| Package Type | — | 780-BBGA, FCBGA (Flip-Chip FineLine BGA) |
| Ball Pitch | — | 1.0 mm |
| Betriebs-Sperrschichttemperatur | — | -40 C to +100 C |
| Configuration | — | SRAM-based, volatile |