EP4CE55F23I7N vs EP4CE55F23C9L Vergleich
Detaillierter Direktvergleich von EP4CE55F23I7N von Intel und EP4CE55F23C9L von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE55F23I7N | EP4CE55F23C9L |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $130,40 | $76,73 |
| Series | Cyclone IV E | — |
| Logic Elements | 55,856 | — |
| Configurable Logic Blocks (CLBs) | 3,491 | — |
| Embedded Memory | 2,396,160 bits | 2,396,160 bits (2.5 Mbit) |
| Embedded 18x18 Multipliers | 56 | 156 |
| PLLs | 4 | 4 |
| Maximum User I/O | 324 | — |
| Gehäuse | 484-ball FBGA (23x23 mm, 1.0 mm pitch) | 484-ball FBGA (F23) |
| Process Technology | TSMC 60 nm low-power | — |
| Core Voltage | 1.2 V | 1.2 V (typical) |
| Betriebstemperatur | -40C to +100C (industrial, I7 grade) | -40C to +85C (industrial) |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Lead-Free / RoHS | Yes (lead-free finish) | — |
| Configuration Modes | JTAG, AS, PS, FPP | — |
| Memory Interface Support | DDR, DDR2, QDRII | — |
| Family | — | Cyclone IV E |
| Logic Elements (LE) | — | 55,856 |
| User I/Os | — | 324 |
| Speed Grade | — | C9 (fastest commercial/industrial) |
| Process Node | — | 60 nm low-power |
| Configuration Method | — | SRAM-based, requires external flash |
| RoHS-Status | — | Compliant |
| MSL-Level | — | [DATA_NEEDED: MSL level] |
| Hard PCIe Blocks | — | 0 (soft PCIe via fabric) |