EP4CE55F23I7N vs EP4CE55F23C9L Comparison
Detailed side-by-side comparison of EP4CE55F23I7N by Intel and EP4CE55F23C9L by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4CE55F23I7N | EP4CE55F23C9L |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Series | Cyclone IV E | — |
| Logic Elements | 55,856 | — |
| Configurable Logic Blocks (CLBs) | 3,491 | — |
| Embedded Memory | 2,396,160 bits | 2,396,160 bits (2.5 Mbit) |
| Embedded 18x18 Multipliers | 56 | 156 |
| PLLs | 4 | 4 |
| Maximum User I/O | 324 | — |
| Package | 484-ball FBGA (23x23 mm, 1.0 mm pitch) | 484-ball FBGA (F23) |
| Process Technology | TSMC 60 nm low-power | — |
| Core Voltage | 1.2 V | 1.2 V (typical) |
| Operating Temperature | -40C to +100C (industrial, I7 grade) | -40C to +85C (industrial) |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| Lead-Free / RoHS | Yes (lead-free finish) | — |
| Configuration Modes | JTAG, AS, PS, FPP | — |
| Memory Interface Support | DDR, DDR2, QDRII | — |
| Family | — | Cyclone IV E |
| Logic Elements (LE) | — | 55,856 |
| User I/Os | — | 324 |
| Speed Grade | — | C9 (fastest commercial/industrial) |
| Process Node | — | 60 nm low-power |
| Configuration Method | — | SRAM-based, requires external flash |
| RoHS Status | — | Compliant |
| MSL Level | — | [DATA_NEEDED: MSL level] |
| Hard PCIe Blocks | — | 0 (soft PCIe via fabric) |