EP4CE55F29I7N vs EP4CE55F29C7N Vergleich
Detaillierter Direktvergleich von EP4CE55F29I7N von Intel und EP4CE55F29C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE55F29I7N | EP4CE55F29C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $154,80 | $138,00 |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements (LE) | 55,856 | 55,856 |
| Embedded Memory Bits | 2,396,160 | — |
| Number of LABs/CLBs | 3491 | — |
| Maximum User I/O | 374 | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) | — |
| Number of PLLs | 4 | [DATA_NEEDED: PLL count] |
| Global Clock Networks | 20 | — |
| Dedicated Clock Pins | 11 | — |
| Embedded Multipliers (18x18) | 154 | [DATA_NEEDED: 18x18 multiplier count] |
| Gehäuse | 780-ball FBGA (F29), 29 mm x 29 mm, 1.0 mm pitch | 780-ball FBGA (F29) |
| Speed Grade | I7 (industrial) | -7 (C7) |
| Betriebs-Sperrschichttemperatur | -40 C to +100 C | — |
| Process Technology | 60 nm low-k | — |
| RoHS-Status | Compliant | Compliant (LEAD FREE) |
| Montageart | Surface Mount | Surface Mount |
| Supply Type | Tray | — |
| Configurable Logic Blocks (CLBs) | — | 3,491 |
| Total RAM Bits | — | 2,396,160 |
| User I/O Count | — | 374 |
| Package Dimensions | — | 29 mm x 29 mm |
| Ball Pitch | — | 1.0 mm |
| Betriebstemperatur | — | 0C to +85C (commercial) |
| Core Voltage | — | 1.2 V nominal |
| Versorgungsspannung | — | 1.2 V |
| Lead Free | — | Yes |
| Configuration Mode | — | JTAG, Active Serial, Passive Parallel |