EP4CE55F29I7N vs EP4CE55F29C7N Comparison
Detailed side-by-side comparison of EP4CE55F29I7N by Intel and EP4CE55F29C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4CE55F29I7N | EP4CE55F29C7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $154.80 | $138.00 |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements (LE) | 55,856 | 55,856 |
| Embedded Memory Bits | 2,396,160 | β |
| Number of LABs/CLBs | 3491 | β |
| Maximum User I/O | 374 | β |
| Core Voltage (VCCINT) | 1.2 V | β |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) | β |
| Number of PLLs | 4 | [DATA_NEEDED: PLL count] |
| Global Clock Networks | 20 | β |
| Dedicated Clock Pins | 11 | β |
| Embedded Multipliers (18x18) | 154 | [DATA_NEEDED: 18x18 multiplier count] |
| Package | 780-ball FBGA (F29), 29 mm x 29 mm, 1.0 mm pitch | 780-ball FBGA (F29) |
| Speed Grade | I7 (industrial) | -7 (C7) |
| Operating Junction Temperature | -40 C to +100 C | β |
| Process Technology | 60 nm low-k | β |
| RoHS Status | Compliant | Compliant (LEAD FREE) |
| Mounting Type | Surface Mount | Surface Mount |
| Supply Type | Tray | β |
| Configurable Logic Blocks (CLBs) | β | 3,491 |
| Total RAM Bits | β | 2,396,160 |
| User I/O Count | β | 374 |
| Package Dimensions | β | 29 mm x 29 mm |
| Ball Pitch | β | 1.0 mm |
| Operating Temperature | β | 0C to +85C (commercial) |
| Core Voltage | β | 1.2 V nominal |
| Supply Voltage | β | 1.2 V |
| Lead Free | β | Yes |
| Configuration Mode | β | JTAG, Active Serial, Passive Parallel |