EP4CE6E22C6 vs EP4CE6E22I7N Vergleich

Detaillierter Direktvergleich von EP4CE6E22C6 von Intel und EP4CE6E22I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP4CE6E22C6 EP4CE6E22I7N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $12,05 $11,85
Family Cyclone IV E Cyclone IV E
Device Logic Elements 6,272 LE —
Logic Array Blocks (LABs) 392 LABs —
Total RAM Bits 270 Kbit —
Embedded 18x18 Multipliers 15 —
PLLs 2 —
Maximum User I/Os 91 —
Core Voltage 1.2 V —
Speed Grade C6 —
Betriebstemperatur 0 °C to +85 °C (Commercial) —
Package Type 144-pin EQFP (Enhanced QFP, exposed pad) —
Package Dimensions 22 mm × 22 mm —
Lead Pitch 0.5 mm —
Montageart Surface Mount Surface Mount
Process Technology TSMC 60 nm low-k 60 nm (TSMC low-power)
Configuration Method SRAM-based (volatile); JTAG, Active Serial, Passive Serial Serial (EPCS) or JTAG
RoHS-Status Compliant Compliant
Logic Elements (LEs) — 6,272
Configurable Logic Blocks (CLBs) — 392
Embedded Memory (RAM) — 270 Kbits
User Flash Memory — 4 Kbits
User I/O Pins — 91
PLLs (General-Purpose) — 2
Global Clock Networks — Up to 20
Core Voltage (VCCINT) — 1.0 V to 1.2 V (nominal 1.2 V)
Operating Temperature (I7 grade) — -40C to +100C (junction)
Maximum Operating Frequency — Up to 472.5 MHz
Gehäuse — 144-pin EQFP (Plastic Enhanced QFP) with exposed pad
Supported I/O Standards — LVDS, LVTTL, LVCMOS, SSTL, HSTL
MSL-Level — 3 (per JEDEC J-STD-020)

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