EP4CE6F17C8 vs EP4CE6F17C6 Vergleich
Detaillierter Direktvergleich von EP4CE6F17C8 von Intel und EP4CE6F17C6 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE6F17C8 | EP4CE6F17C6 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $19,85 | $12,10 |
| Device Family | Cyclone IV E | — |
| Logic Elements (LEs) | 6,272 | — |
| Logic Array Blocks (LABs) | 392 | — |
| Embedded Memory Bits | 276,480 | — |
| M9K Memory Blocks | 30 | — |
| Embedded 18 x 18 Multipliers | 15 | — |
| PLLs | 2 | 2 |
| Global Clock Networks | 10 | — |
| Maximum User I/Os | 179 | — |
| Gehäuse | 256-ball FBGA (F17), 1.0 mm pitch, 17 x 17 mm | 256-FBGA 17x17 mm, 1.0 mm pitch |
| Process Technology | 60 nm low-power SRAM | — |
| Core Supply Voltage | 1.0 V to 1.2 V | — |
| Betriebstemperatur | 0 C to 85 C (commercial, C8 speed grade) | — |
| Speed Grade | C8 | C6 (commercial) |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP) | — |
| I/O Standards Supported | LVTTL, LVCMOS, LVDS, SSTL, HSTL | — |
| RoHS-Status | Compliant | Compliant |
| Family | — | Cyclone IV E |
| Logic Elements (LE) | — | 6,272 |
| Configurable Logic Blocks (CLB) | — | 392 |
| Embedded Memory | — | 276,480 bits |
| Embedded 18x18 Multipliers | — | 15 |
| Maximum User I/O | — | 179 |
| Betriebs-Sperrschichttemperatur | — | 0°C to 85°C |
| Core Voltage VCCINT | — | 1.2 V (typical) |
| Process Node | — | 60 nm low-power |
| I/O Banks | — | 8 |
| Memory Blocks | — | M9K (30 blocks) |
| Configuration Mode | — | Active Serial (AS), Passive Serial (PS), JTAG |
| Montageart | — | Surface Mount (FBGA) |
| MSL-Level | — | 3 (168 hours) |