EP4CGX110DF27I7N - Cyclone IV GX FPGA, 110K LEs, 672-FBGA | Intel
Teilenummer: EP4CGX110DF27I7N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $268.5 | $2.685,00 |
| 100 | $245 | $24.500,00 |
| 500 | $220 | $110.000,00 |
| 1.000 | $198 | $198.000,00 |
EP4CGX110DF27I7N Übersicht
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric. FPGAs sit in the digital logic hierarchy above fixed-function ASICs and below microcontrollers for parallel, high-throughput workloads. The Cyclone IV GX family specifically targets cost-sensitive, transceiver-equipped applications, combining low static power (~0.5 W typical) with multi-gigabit serial I/O.
Key differentiating features of the EP4CGX110DF27I7N include eight integrated 3.125 Gbps transceivers, four PCI Express hard IP blocks (PIPE-ready), and 5.4 Mbits of embedded RAM. The 672-FBGA package supports 393 general-purpose I/Os with LVDS, LVTTL, LVCMOS, and SSTL-18 signaling, enabling direct interface to DDR2 SDRAM and external parallel buses without glue logic.
Architecturally, the device uses a 60 nm process node with a sea-of-LABs fabric, embedded 9-Kbit M9K memory blocks, and dedicated 18x18 multipliers for DSP operations. Hard IP blocks for PCIe Gen1 (x1/x2/x4), memory controllers, and PLL-based clock management reduce soft logic overhead and improve timing closure for serial-protocol designs.
Typical applications include industrial video bridging, motor-control coprocessors, low-end wireless baseband, PCI Express endpoint cards, and protocol-conversion glue logic. The integrated transceivers make the EP4CGX110DF27I7N especially attractive for designs that previously required a separate PHY plus an FPGA. Wide industrial-grade operating temperature range and rugged FBGA packaging also suit factory-floor deployments.
When designing with this device, engineers must respect the PCB layout rules for 1.0 mm-pitch FBGA, including microvia stack-ups and matched-length differential pairs for the transceiver lanes. The Quartus Prime design suite (free Web Edition) supports the entire Cyclone IV GX family.
This page synthesizes distributor inventory, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in-Alternativen für EP4CGX110DF27I7N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP4CGX110DF27I7N (gleiche Bauform und Footprint) – abweichend in Package, Speed Grade, Transceivers, Process Technology, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP4CGX110DF27I7
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →EP4CGX110DF27C8N
✅ Drop-In✓ Auf Lager
$152.3 / Stück
Datenblatt ansehen →EP4CGX110DF27C7N
✅ Drop-In✓ Auf Lager
$204.2 / Stück
Datenblatt ansehen →EP4CGX110DF27I7N Grenzwerte & elektrische Eigenschaften
| Series | Cyclone IV GX |
| Device Family | EP4CGX110 |
| Logic Elements (LEs) | 109,424 |
| Logic Array Blocks (LABs) | 6,422 |
| Embedded Memory (bits) | 5,621,760 |
| Memory Blocks (M9K) | 610 |
| Embedded 18x18 Multipliers | 280 |
| User I/Os | 393 |
| Transceivers | 8 channels, up to 3.125 Gbps |
| PCIe Hard IP Blocks | 4 (Gen1 x1/x2/x4) |
| PLLs | 4 |
| Core Voltage | 1.2 V |
| Betriebstemperatur | -40C to +100C (Industrial) |
| Gehäuse | 672-ball FBGA, 1.0 mm pitch |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
| Process Node | 60 nm |
| Configuration Scheme | AS, PS, JTAG, FPP |
EP4CGX110DF27I7N 672-ball fbga, 1.0 mm pitch Pinbelegungsleitfaden
Pinbelegung für EP4CGX110DF27I7N (672-ball fbga, 1.0 mm pitch-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP4CGX110DF27I7N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP4CGX110DF27I7N ist geeignet für 6 Anwendungs: Industrial Video Bridging & Surveillance, PCI Express Endpoint Cards, Motor Control & Industrial Automation, Wireless Baseband & Protocol Conversion, Test & Measurement Instrumentation, Display & Video Wall Controllers.
Industrial Video Bridging & Surveillance
The EP4CGX110DF27I7N's 8 multi-gigabit transceivers and 109,424 logic elements enable real-time bridging between camera sensors using MIPI, LVDS, or parallel CMOS interfaces and GigE Vision / SDI uplink links. The 3.125 Gbps serial bandwidth supports uncompressed HD-SDI transport, while 5.6 Mbits of embedded RAM buffer line-scan and Bayer-pattern processing. Industrial-grade -40C to +100C operation suits outdoor cabinet installations.
Empfohlen
PCI Express Endpoint Cards
The EP4CGX110DF27I7N integrates 4 hard PCI Express Gen1 IP cores supporting x1, x2, and x4 lane configurations, eliminating the need for a soft PCIe PHY. The 280 embedded 18x18 multipliers accelerate endpoint DMA and protocol handling. Designers can implement low-cost PCIe cards (NICs, data acquisition, industrial I/O) without external bridge chips, saving BOM cost and board area.
Empfohlen
Motor Control & Industrial Automation
Factory automation requires deterministic PWM generation, quadrature encoder decoding, and fieldbus bridging. The EP4CGX110DF27I7N's 280 dedicated multipliers handle field-oriented control (FOC) algorithms in real time, while the integrated transceivers interface to EtherCAT, Profinet, or SERCOS III slave stacks via dedicated PHY partners. Industrial temperature qualification supports cabinet-free machine mounting.
Empfohlen
Wireless Baseband & Protocol Conversion
Small-cell wireless baseband and protocol-conversion designs use the EP4CGX110DF27I7N's CPRI / OBSAI serial links operating at 614 Mbps to 3.072 Gbps. The 109K logic elements support LTE PHY layer functions, while embedded memory buffers HARQ and de-interleaving tasks. The 1.2 V core keeps typical power dissipation under 1.5 W, suitable for fanless outdoor radio units.
Empfohlen
Test & Measurement Instrumentation
The EP4CGX110DF27I7N serves as the digital backbone of bench-top instruments: arbitrary waveform generators, logic analyzers, and protocol testers. The 393 user I/Os provide abundant parallel probing channels, while the 8 transceivers handle high-speed serial stimulus/response. The industrial temperature range and rugged FBGA package suit portable field instruments.
Empfohlen
Display & Video Wall Controllers
Driving multi-panel LCD walls, the EP4CGX110DF27I7N's 5.6 Mbits of embedded RAM acts as a multi-buffered frame store for up to 4 simultaneous 1080p60 video streams. The 393 I/Os support LVDS pairs for direct panel attachment, while the integrated transceivers route pixel data over long-distance serial links to remote display panels in digital-signage installations.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP4CGX110DF27I7N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP4CGX110DF27I7 | EP4CGX110DF27C8N | EP4CGX110DF27C7N |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-ball FBGA | 672-ball FBGA - same | 672-ball FBGA - same | 672-ball FBGA - same |
| Logic Elements | 109,424 | 109,424 | 109,424 | 109,424 |
| Embedded Memory (bits) | 5,621,760 | 5,621,760 | 5,621,760 | 5,621,760 |
| User I/Os | 393 | 393 | 393 | 393 |
| Transceivers | 8 (up to 3.125 Gbps) | 8 (up to 3.125 Gbps) | 8 (up to 3.125 Gbps) | 8 (up to 3.125 Gbps) |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Speed Grade | -7 (faster) | -7 | -8 (slower, lower cost) | -7 |
Wichtigste Unterscheidungsmerkmale
- Integrated multi-gigabit transceivers eliminate external PHY cost (vs. EP4CE55F29I7N (Cyclone IV E, no transceivers))
- Industrial temperature grade supports harsh environments (vs. EP4CGX110DF27C8N (commercial grade))
- Smaller FBGA package for space-constrained designs (vs. EP4CGX110DF31I7N (896-FBGA))
Designhinweise
The 672-ball FBGA uses a 1.0 mm pitch, which requires microvia (laser-drilled) stack-ups rather than conventional through-via PCBs. Use at minimum a 6-layer stack-up with the FPGA on the top layer, a continuous ground plane on layer 2, and split power planes on layers 3-5 for the 1.2 V core, 2.5 V analog, and 3.3 V I/O rails. All decoupling capacitors must be placed on the BGA footprint side, with 0402-size 0.1 uF caps within 100 mils of every power pin.
The 8 multi-gigabit transceiver channels require 100-ohm differential routing with intra-pair skew under 5 mils and length matching to within 10 mils across P and N. Use a continuous reference ground plane beneath each transceiver lane; do not route over plane splits. Per Intel Cyclone IV GX layout guidelines, place AC-coupling capacitors within 200 mils of the FPGA transmitter pins and maintain 4W spacing between adjacent TX/RX channels.
Estimated: at typical industrial use (VCCINT 1.2 V, 60% toggle rate, junction 85C), the EP4CGX110DF27I7N dissipates approximately 1.2-1.8 W. A modest thermal copper pour (at least 1 square inch connected to the central BGA balls) keeps junction rise below 15C above ambient without a heatsink. For sealed enclosures with no airflow, consider a small aluminum heatsink bonded to the package top.
Do not assume bitstream compatibility between speed grades. The -7 and -8 speed grade variants have different timing margins; recompile the Quartus Prime design with the appropriate device selection before programming. Also, never use a commercial-grade EP4CGX110DF27C7N/C8N in an industrial environment expecting -40C operation; the silicon is qualified only to 0C minimum and may fail cold-start.
Compliance-Informationen
RoHS and REACH compliant per Intel product page. The 'N' suffix in the OPN indicates lead-free / RoHS-compliant packaging. AEC-Q100 is not applicable as this is a commercial/industrial FPGA, not an automotive-qualified IC.
