EP4SGX110HF35C3G vs EP4SGX110DF29C3G Vergleich

Detaillierter Direktvergleich von EP4SGX110HF35C3G von Intel und EP4SGX110DF29C3G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP4SGX110HF35C3G EP4SGX110DF29C3G
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $3.128,75 $2.610,50
Series Stratix IV GX Stratix IV GX
Family Stratix IV Stratix IV GX
Sub-family GX (transceiver-optimized) —
Logic Elements 105,600 105,600
Embedded Memory Bits 9,793,536 —
Embedded Memory (Kbits) 9,564 Kbit (9793536 bits) —
Number of Logic Array Blocks [DATA_NEEDED: LAB count] —
Number of Registers [DATA_NEEDED: register count] —
Maximum User I/O 488 —
Transceiver Channels 8 (up to 8.5 Gbps) —
Number of Transceivers 8 —
Transceiver Data Rate 3.125 Gbps (low-power mode) - 8.5 Gbps Up to 8.5 Gbps
18x18 Multipliers [DATA_NEEDED: DSP block count] —
PCIe Hard IP Yes —
Gehäuse 1152-BBGA, FCBGA (HF35, 35x35 mm) —
Package Code HF35 (FineLine BGA, 35mm) —
Speed Grade C3 (commercial) —
Betriebstemperatur [DATA_NEEDED: junction temperature range] Commercial (0C to +85C) - per C3 grade suffix
Process Technology 40 nm TSMC 40 nm
Montageart Surface Mount Surface Mount (Flip-Chip BGA)
RoHS-Status Compliant (lead-free FBGA) [DATA_NEEDED: RoHS compliance status]
MSL-Level [DATA_NEEDED: MSL rating] —
Adaptive Logic Modules (ALMs) — 4,224 LABs
Total Memory Bits — 9,793,536
User I/O Count — 372
Package Type — 780-BBGA, FCBGA (Flip-Chip)
Package Pin/Ball Count — 780
Versorgungsspannung — 0.9 V core
Transceiver Count — [DATA_NEEDED: number of transceivers]
DSP Blocks — 266 (18x18 multipliers)

Datenblätter & Ressourcen

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