EP4SGX110HF35C3G vs EP4SGX110DF29C3G 비교
다음의 상세 나란히 비교: EP4SGX110HF35C3G 제조: Intel 및 EP4SGX110DF29C3G 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | EP4SGX110HF35C3G | EP4SGX110DF29C3G |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $3,128.75 | $2,610.50 |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV | Stratix IV GX |
| Sub-family | GX (transceiver-optimized) | — |
| Logic Elements | 105,600 | 105,600 |
| Embedded Memory Bits | 9,793,536 | — |
| Embedded Memory (Kbits) | 9,564 Kbit (9793536 bits) | — |
| Number of Logic Array Blocks | [DATA_NEEDED: LAB count] | — |
| Number of Registers | [DATA_NEEDED: register count] | — |
| Maximum User I/O | 488 | — |
| Transceiver Channels | 8 (up to 8.5 Gbps) | — |
| Number of Transceivers | 8 | — |
| Transceiver Data Rate | 3.125 Gbps (low-power mode) - 8.5 Gbps | Up to 8.5 Gbps |
| 18x18 Multipliers | [DATA_NEEDED: DSP block count] | — |
| PCIe Hard IP | Yes | — |
| 패키지 | 1152-BBGA, FCBGA (HF35, 35x35 mm) | — |
| Package Code | HF35 (FineLine BGA, 35mm) | — |
| Speed Grade | C3 (commercial) | — |
| 동작 온도 | [DATA_NEEDED: junction temperature range] | Commercial (0C to +85C) - per C3 grade suffix |
| Process Technology | 40 nm TSMC | 40 nm |
| 실장 유형 | Surface Mount | Surface Mount (Flip-Chip BGA) |
| RoHS 상태 | Compliant (lead-free FBGA) | [DATA_NEEDED: RoHS compliance status] |
| MSL 레벨 | [DATA_NEEDED: MSL rating] | — |
| Adaptive Logic Modules (ALMs) | — | 4,224 LABs |
| Total Memory Bits | — | 9,793,536 |
| User I/O Count | — | 372 |
| Package Type | — | 780-BBGA, FCBGA (Flip-Chip) |
| Package Pin/Ball Count | — | 780 |
| 공급 전압 | — | 0.9 V core |
| Transceiver Count | — | [DATA_NEEDED: number of transceivers] |
| DSP Blocks | — | 266 (18x18 multipliers) |