EP4SGX110HF35I3G vs EP4S100G2F40I3G Vergleich

Detaillierter Direktvergleich von EP4SGX110HF35I3G von Intel und EP4S100G2F40I3G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP4SGX110HF35I3G EP4S100G2F40I3G
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $7.900,00 $5.680,00
Logic Elements 105,600 228,000
Embedded Memory Bits 9,793,536 (9.4 Mbit) —
Maximum User I/O Pins 488 —
Multipliers (18x18) 352 —
Core Supply Voltage (nominal) 0.9 V —
Gehäuse 1152-ball FC-FBGA (HF35), 35 x 35 mm, 1.0 mm pitch 1517-BBGA, FCBGA (40x40 mm)
Family Stratix IV GX Stratix IV
Speed/Grade I3 (Industrial, -3 speed) —
Betriebs-Sperrschichttemperatur -40 C to +100 C —
Multi-Gigabit Transceivers 8 channels (3.125 Gbps to 8.5 Gbps per family datasheet) —
Hard IP Blocks PCIe Gen1/Gen2, external memory PHY —
Montageart Surface Mount (Flip-Chip BGA) Surface Mount (BGA)
MSL-Level [DATA_NEEDED: MSL level] —
RoHS-Status Compliant Compliant
Lead-Free / Halogen-Free Lead-free —
Process Technology 40 nm low-power CMOS 40 nm
Configuration Memory SRAM-based (volatile, requires configuration device) —
Series — Stratix IV GT
Logic Array Blocks (LABs) — 91,200
Total RAM Bits — 17,544,192
Operating Voltage (Core) — 0.86 V to 1.15 V
Betriebstemperaturbereich — -40 °C to 100 °C Tj (industrial)
Number of I/O — [DATA_NEEDED: pin/ball count - exact user I/O count]
Transceivers — [DATA_NEEDED: number of high-speed transceivers]
DSP Blocks — [DATA_NEEDED: DSP block count]
User Flash Memory — [DATA_NEEDED: configuration flash size]
Configuration Scheme — SRAM-based, configuration via JTAG/AS/PS/Fast passive parallel
Feuchtigkeitsempfindlichkeitsgrad (MSL) — 3 (per JEDEC J-STD-020)
Lead-Free — Yes

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern