EP4SGX360HF35C2 vs EP4SGX360HF35I3 Vergleich
Detaillierter Direktvergleich von EP4SGX360HF35C2 von Intel und EP4SGX360HF35I3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX360HF35C2 | EP4SGX360HF35I3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $9.750,00 | $650,00 |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV GX FPGA | Stratix IV GX Field Programmable Gate Array |
| Logic Elements (LEs) | 353,600 | 353,600 |
| LABs/CLBs | 14,144 | — |
| Number of I/O | 564 (max 532 user I/O) | — |
| Embedded Memory (bits) | 23,105,536 | 23,105,536 |
| Number of Logic Cells | 353,600 | — |
| Core Voltage | 0.9 V | 0.9 V |
| Process Technology | 40 nm | 40 nm |
| Transceivers | Multi-gigabit serial transceivers (PCIe Gen2/XAUI/CEI-6G capable) | — |
| Package Type | 1152-pin FC-FBGA | 1152-Ball FCBGA (FineLine BGA) |
| Package Code | HF35 (35x35 mm, 1.0 mm pitch) | — |
| Montageart | Surface Mount (Flip-Chip BGA) | Surface Mount (BGA) |
| Betriebstemperatur | 0C to +85C (commercial) | -40 °C to +100 °C (Industrial) |
| RoHS-Status | Compliant | Compliant |
| Configuration | JTAG / Active Serial (external config device) | — |
| Design Tool | Quartus II / Quartus Prime | — |
| Manufacturer | — | Intel (formerly Altera) |
| Total LABs | — | 14,144 |
| User I/Os | — | 564 |
| Speed Grade | — | F35 |
| I/O Standards Supported | — | LVDS, LVTTL, LVPECL, HSTL, SSTL |
| Embedded Transceivers | — | Yes (multi-gigabit) |
| DSP Blocks | — | Yes (hard DSP blocks) |
| Configuration Modes | — | Serial, Parallel, JTAG, Active Serial |