EP4SGX530HH35C3 vs EP4SGX530HH35C4 Vergleich
Detaillierter Direktvergleich von EP4SGX530HH35C3 von Intel und EP4SGX530HH35C4 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX530HH35C3 | EP4SGX530HH35C4 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2.398,00 | $3.120,00 |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV | — |
| Logic Elements (LE) | 531,200 | — |
| LABs / CLBs | 21,248 | — |
| Total RAM Bits | 28,033,024 | — |
| User I/O Count | 564 | — |
| Gehäuse | 1152-BBGA / FCBGA (HFBGA) | 1152-ball FCBGA / FBGA (42.5 x 42.5 mm) |
| Core Voltage | 0.87 V to 0.93 V | — |
| Process Technology | 40 nm CMOS | 40 nm |
| Transceivers | 24 channels, up to 8.5 Gbps | Up to 24 multi-gigabit transceivers at up to 8.5 Gbps [DATA_NEEDED: exact count for this package] |
| DSP Blocks | 1024 (18x18 multipliers) | [DATA_NEEDED: block count for this density] |
| Betriebstemperatur | 0C to +85C (Commercial) | 0 C to 85 C (Commercial, -C4 suffix) |
| Speed Grade | C3 | HH35 |
| Montageart | Surface Mount | Surface Mount (flip-chip BGA) |
| RoHS-Status | Compliant | Compliant |
| Device Type | — | FPGA |
| Logic Elements | — | 531,200 |
| Adaptive Logic Modules (ALMs) | — | 21,248 LABs / 212,480 equivalent LEs |
| Embedded Memory (bits) | — | 28,033,024 |
| Maximum User I/O Pins | — | 564 |
| Core Supply Voltage | — | 0.9 V |
| PLLs | — | 8 fractional PLLs |
| MSL-Level | — | MSL3 (per BGA package standard) |