EP4SGX530HH35C3 vs EP4SGX530HH35C4 Comparación
Comparación detallada lado a lado de EP4SGX530HH35C3 por Intel y EP4SGX530HH35C4 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4SGX530HH35C3 | EP4SGX530HH35C4 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2.398,00 | $3.120,00 |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV | — |
| Logic Elements (LE) | 531,200 | — |
| LABs / CLBs | 21,248 | — |
| Total RAM Bits | 28,033,024 | — |
| User I/O Count | 564 | — |
| Encapsulado | 1152-BBGA / FCBGA (HFBGA) | 1152-ball FCBGA / FBGA (42.5 x 42.5 mm) |
| Core Voltage | 0.87 V to 0.93 V | — |
| Process Technology | 40 nm CMOS | 40 nm |
| Transceivers | 24 channels, up to 8.5 Gbps | Up to 24 multi-gigabit transceivers at up to 8.5 Gbps [DATA_NEEDED: exact count for this package] |
| DSP Blocks | 1024 (18x18 multipliers) | [DATA_NEEDED: block count for this density] |
| Temperatura de funcionamiento | 0C to +85C (Commercial) | 0 C to 85 C (Commercial, -C4 suffix) |
| Speed Grade | C3 | HH35 |
| Tipo de montaje | Surface Mount | Surface Mount (flip-chip BGA) |
| Estado RoHS | Compliant | Compliant |
| Device Type | — | FPGA |
| Logic Elements | — | 531,200 |
| Adaptive Logic Modules (ALMs) | — | 21,248 LABs / 212,480 equivalent LEs |
| Embedded Memory (bits) | — | 28,033,024 |
| Maximum User I/O Pins | — | 564 |
| Core Supply Voltage | — | 0.9 V |
| PLLs | — | 8 fractional PLLs |
| Nivel MSL | — | MSL3 (per BGA package standard) |