EP4SGX70DF29I3G vs EP4SGX70HF35I3G Vergleich
Detaillierter Direktvergleich von EP4SGX70DF29I3G von Intel und EP4SGX70HF35I3G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX70DF29I3G | EP4SGX70HF35I3G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.080,00 | $1.250,00 |
| Series | Stratix IV GX | Stratix IV GX |
| Process Technology | 40 nm | 40 nm TSMC |
| Logic Elements (LE) | 72,600 | — |
| Embedded Memory Bits | 7,564,880 (about 7.5 Mbit) | — |
| Embedded Memory Blocks | 72600 | — |
| Number of Logic Cells / Arrays | 372 | — |
| Number of User I/O Pins | 372 | — |
| Number of Transceiver Channels | [DATA_NEEDED: exact channel count for this device] | — |
| Transceiver Data Rate | [DATA_NEEDED: per-channel data rate] | — |
| Package Type | 780-Ball FCBGA (Fine-pitch Chip-Scale BGA, flip-chip) | — |
| Package Code | DF29 | — |
| Operating Temperature Grade | Industrial (I3) | — |
| Junction Temperature Range | -40C to +100C | — |
| Core Supply Voltage | 0.87 V to 0.93 V | 950 mV |
| Speed Grade | -3 | I3 |
| Montageart | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| MSL-Level | [DATA_NEEDED: MSL rating] | — |
| RoHS-Status | Compliant | — |
| Halogenfrei | [DATA_NEEDED: halogen-free claim] | — |
| Logic Elements | — | 72,600 LE |
| Adaptive Logic Modules (ALMs) | — | 29,040 ALM |
| Embedded Memory | — | 7.20 Mbit (7,564,880 bits) |
| User I/Os | — | 480 |
| Transceivers | — | 9 channels up to 8.5 Gbps (GX) |
| 18x18 Multipliers | — | 488 |
| PLLs | — | 4 per quadrant |
| Betriebstemperatur | — | -40C to +100C (Industrial) |
| Gehäuse | — | 1152-ball FCBGA, 35x35 mm, 1.0 mm pitch |
| Packaging | — | Tray |