EP4SGX70DF29I3G vs EP4SGX70HF35I3G 对比
详细并排对比 EP4SGX70DF29I3G 出自 Intel 和 EP4SGX70HF35I3G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP4SGX70DF29I3G | EP4SGX70HF35I3G |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,080.00 | $1,250.00 |
| Series | Stratix IV GX | Stratix IV GX |
| Process Technology | 40 nm | 40 nm TSMC |
| Logic Elements (LE) | 72,600 | — |
| Embedded Memory Bits | 7,564,880 (about 7.5 Mbit) | — |
| Embedded Memory Blocks | 72600 | — |
| Number of Logic Cells / Arrays | 372 | — |
| Number of User I/O Pins | 372 | — |
| Number of Transceiver Channels | [DATA_NEEDED: exact channel count for this device] | — |
| Transceiver Data Rate | [DATA_NEEDED: per-channel data rate] | — |
| Package Type | 780-Ball FCBGA (Fine-pitch Chip-Scale BGA, flip-chip) | — |
| Package Code | DF29 | — |
| Operating Temperature Grade | Industrial (I3) | — |
| Junction Temperature Range | -40C to +100C | — |
| Core Supply Voltage | 0.87 V to 0.93 V | 950 mV |
| Speed Grade | -3 | I3 |
| 安装类型 | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| MSL 等级 | [DATA_NEEDED: MSL rating] | — |
| RoHS 状态 | Compliant | — |
| 无卤 | [DATA_NEEDED: halogen-free claim] | — |
| Logic Elements | — | 72,600 LE |
| Adaptive Logic Modules (ALMs) | — | 29,040 ALM |
| Embedded Memory | — | 7.20 Mbit (7,564,880 bits) |
| User I/Os | — | 480 |
| Transceivers | — | 9 channels up to 8.5 Gbps (GX) |
| 18x18 Multipliers | — | 488 |
| PLLs | — | 4 per quadrant |
| 工作温度 | — | -40C to +100C (Industrial) |
| 封装 | — | 1152-ball FCBGA, 35x35 mm, 1.0 mm pitch |
| Packaging | — | Tray |