EPF10K100EBC356-2 vs EPF10K100EBC356-1X Vergleich

Detaillierter Direktvergleich von EPF10K100EBC356-2 von Intel und EPF10K100EBC356-1X von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EPF10K100EBC356-2 EPF10K100EBC356-1X
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $59,95 $165,00
Series FLEX-10KE FLEX 10KE
Family Embedded Programmable Logic Device (PLD) —
Typical Gates 100,000 100,000
Maximum System Gates 158,000 —
Logic Elements (LEs) 4,992 —
Number of LABs/CLBs 624 —
Embedded Array Blocks (EABs) 12 12
Total RAM Bits 49,152 49,152
User I/O Pins 274 —
Supply Voltage (Core) 2.375 V to 2.625 V (2.5 V nominal) —
Propagation Delay (tPD) 0.5 ns —
Internal Operating Frequency up to 250 MHz —
Process Technology CMOS, SRAM-based —
Package Type 356-LBGA (35 x 35 mm, 1.27 mm pitch) 356-LBGA (BGA-356)
Betriebstemperatur 0 C to 70 C (Commercial) 0 C to +70 C (Commercial)
Montageart Surface Mount Surface Mount (BGA)
Configuration Method SRAM, JTAG (IEEE 1149.1) Serial EPROM / Parallel EPROM / JTAG (IEEE 1149.1)
Speed Grade -2 -1X
RoHS-Status [DATA_NEEDED: RoHS compliance] [DATA_NEEDED: RoHS status]
Lead-Free [DATA_NEEDED: lead-free status] —
Logic Elements — 4,992
Logic Array Blocks (LABs) — 624
User I/O Count — 274
Propagation Delay — 0.6 ns
Logic Family — CMOS
Core Process Technology — 0.22 um CMOS, 5 metal layers
Core Supply Voltage — 2.5 V (2.375 V to 2.625 V)
I/O Supply Voltage — 3.3 V (multi-volt tolerant to 5 V)
Package Dimensions — 35 x 35 mm, 1.27 mm ball pitch
MSL-Level — [DATA_NEEDED: MSL rating]

Datenblätter & Ressourcen

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