EPF10K100EBC356-2 vs EPF10K100EBC356-1X 比較
詳細な並列比較: EPF10K100EBC356-2 メーカー: Intel および EPF10K100EBC356-1X メーカー: Intel。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。
Intel
EPF10K100EBC356-2 - 100K Gates FLEX 10KE FPGA 274 I/O BGA-356 | Intel
EPF10K100EBC356-2 Obsolete仕様比較
| パラメータ | EPF10K100EBC356-2 | EPF10K100EBC356-1X |
|---|---|---|
| ブランド | Intel | Intel |
| カテゴリ | FPGA & CPLD | FPGA & CPLD |
| ライフサイクル状態 | Obsolete | NRND |
| 在庫状況 | In Stock | In Stock |
| 単価（USD） | $59.95 | $165.00 |
| Series | FLEX-10KE | FLEX 10KE |
| Family | Embedded Programmable Logic Device (PLD) | — |
| Typical Gates | 100,000 | 100,000 |
| Maximum System Gates | 158,000 | — |
| Logic Elements (LEs) | 4,992 | — |
| Number of LABs/CLBs | 624 | — |
| Embedded Array Blocks (EABs) | 12 | 12 |
| Total RAM Bits | 49,152 | 49,152 |
| User I/O Pins | 274 | — |
| Supply Voltage (Core) | 2.375 V to 2.625 V (2.5 V nominal) | — |
| Propagation Delay (tPD) | 0.5 ns | — |
| Internal Operating Frequency | up to 250 MHz | — |
| Process Technology | CMOS, SRAM-based | — |
| Package Type | 356-LBGA (35 x 35 mm, 1.27 mm pitch) | 356-LBGA (BGA-356) |
| 動作温度 | 0 C to 70 C (Commercial) | 0 C to +70 C (Commercial) |
| 実装タイプ | Surface Mount | Surface Mount (BGA) |
| Configuration Method | SRAM, JTAG (IEEE 1149.1) | Serial EPROM / Parallel EPROM / JTAG (IEEE 1149.1) |
| Speed Grade | -2 | -1X |
| RoHS ステータス | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS status] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Logic Elements | — | 4,992 |
| Logic Array Blocks (LABs) | — | 624 |
| User I/O Count | — | 274 |
| Propagation Delay | — | 0.6 ns |
| Logic Family | — | CMOS |
| Core Process Technology | — | 0.22 um CMOS, 5 metal layers |
| Core Supply Voltage | — | 2.5 V (2.375 V to 2.625 V) |
| I/O Supply Voltage | — | 3.3 V (multi-volt tolerant to 5 V) |
| Package Dimensions | — | 35 x 35 mm, 1.27 mm ball pitch |
| MSLレベル | — | [DATA_NEEDED: MSL rating] |