EPF10K100EBC356-2 vs EPF10K100EBC356-1X 对比
详细并排对比 EPF10K100EBC356-2 出自 Intel 和 EPF10K100EBC356-1X 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Intel
EPF10K100EBC356-2 - 100K Gates FLEX 10KE FPGA 274 I/O BGA-356 | Intel
EPF10K100EBC356-2 Obsolete规格对比
| 参数 | EPF10K100EBC356-2 | EPF10K100EBC356-1X |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | Obsolete | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $59.95 | $165.00 |
| Series | FLEX-10KE | FLEX 10KE |
| Family | Embedded Programmable Logic Device (PLD) | — |
| Typical Gates | 100,000 | 100,000 |
| Maximum System Gates | 158,000 | — |
| Logic Elements (LEs) | 4,992 | — |
| Number of LABs/CLBs | 624 | — |
| Embedded Array Blocks (EABs) | 12 | 12 |
| Total RAM Bits | 49,152 | 49,152 |
| User I/O Pins | 274 | — |
| Supply Voltage (Core) | 2.375 V to 2.625 V (2.5 V nominal) | — |
| Propagation Delay (tPD) | 0.5 ns | — |
| Internal Operating Frequency | up to 250 MHz | — |
| Process Technology | CMOS, SRAM-based | — |
| Package Type | 356-LBGA (35 x 35 mm, 1.27 mm pitch) | 356-LBGA (BGA-356) |
| 工作温度 | 0 C to 70 C (Commercial) | 0 C to +70 C (Commercial) |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| Configuration Method | SRAM, JTAG (IEEE 1149.1) | Serial EPROM / Parallel EPROM / JTAG (IEEE 1149.1) |
| Speed Grade | -2 | -1X |
| RoHS 状态 | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS status] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Logic Elements | — | 4,992 |
| Logic Array Blocks (LABs) | — | 624 |
| User I/O Count | — | 274 |
| Propagation Delay | — | 0.6 ns |
| Logic Family | — | CMOS |
| Core Process Technology | — | 0.22 um CMOS, 5 metal layers |
| Core Supply Voltage | — | 2.5 V (2.375 V to 2.625 V) |
| I/O Supply Voltage | — | 3.3 V (multi-volt tolerant to 5 V) |
| Package Dimensions | — | 35 x 35 mm, 1.27 mm ball pitch |
| MSL 等级 | — | [DATA_NEEDED: MSL rating] |