EPF10K130EFC484-3N vs EPF10K130EFI484-2 Vergleich
Detaillierter Direktvergleich von EPF10K130EFC484-3N von Intel und EPF10K130EFI484-2 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPF10K130EFC484-3N | EPF10K130EFI484-2 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $109,25 | $92,00 |
| Series | FLEX-10KE | — |
| Number of Logic Elements / Cells | 6656 | — |
| Total RAM Bits | 65536 | 65,536 bits |
| Typical Gate Count | 130000 | — |
| Number of I/O | 369 | — |
| Number of LABs/CLBs | 832 | — |
| Number of Embedded Array Blocks (EABs) | 72 | — |
| Speed Grade | -3 (faster timing bin) | — |
| Operating Temperature Grade | Commercial (0C to +70C) | — |
| Core Voltage | 2.5 V | — |
| Process Technology | 0.22 µm CMOS | 0.22 µm CMOS |
| Package Type | 484-BBGA (FineLine BGA) | — |
| Package Dimensions | 23 x 23 mm | — |
| Ball Pitch | 1.0 mm | — |
| Montageart | Surface Mount | Surface Mount |
| Configuration Memory | SRAM-based (volatile, requires config device) | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Configuration Interface | JTAG / PS / PPS / Altera serial | — |
| Family | — | FLEX 10KE |
| Logic Elements / Cells | — | 6,656 |
| Equivalent Gate Count | — | 130,000 gates |
| User I/Os | — | 274 |
| Number of Logic Array Blocks | — | 1,664 LABs |
| Number of Embedded Array Blocks | — | [DATA_NEEDED: EAB count] |
| Internal Clock Frequency | — | 333.33 MHz |
| Propagation Delay | — | 0.6 ns |
| Core Supply Voltage | — | 2.5 V |
| I/O Supply Voltage | — | 3.3 V (PCI-compliant) |
| Betriebstemperatur | — | 0 °C to 70 °C (commercial) |
| Gehäuse | — | 484-ball FineLine BGA (FBGA-484) |
| MSL-Level | — | [DATA_NEEDED: MSL rating] |