EPF10K200SBC356-3 vs EPF10K200SBC356-2X Vergleich

Detaillierter Direktvergleich von EPF10K200SBC356-3 von Intel und EPF10K200SBC356-2X von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EPF10K200SBC356-3 EPF10K200SBC356-2X
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $87,50 $295,00
Family FLEX 10K FLEX 10K
Device Type FPGA - Field Programmable Gate Array —
Typical Gates 200,000 —
Logic Elements (Cells) 9,984 —
Logic Array Blocks (LABs) 1,248 1248
Embedded Array Blocks (EABs) 12 —
Total EAB RAM 98,304 bits —
User I/Os 470 (package exposes 274 bonded-out) —
Flip-Flops 4,992 —
Process Technology 0.22 um CMOS, 4 metal layers CMOS 0.22 µm
Core Supply Voltage 2.375 V to 2.625 V —
Propagation Delay 0.4 ns —
Internal Performance (fmax) 250 MHz —
Betriebstemperatur 0 C to 70 C (Commercial) 0 °C to +70 °C (commercial)
Gehäuse PBGA-356 (35 x 35 mm, 1.27 mm pitch) 356-LBGA (35x35 mm, 1.27 mm pitch)
Montageart Surface Mount Surface Mount
Configuration Mode Passive Serial / Passive Parallel / JTAG —
MultiVolt I/O 2.5 V / 3.3 V / 5.0 V —
Logic Family CMOS —
RoHS-Status [DATA_NEEDED: rohs status] —
Series — FLEX-10KS
Logic Elements / Cells — 9984
Approximate Gate Count — 200,000
User I/O Count — 274
Versorgungsspannung — 2.375 V to 2.625 V (core)
Propagation Delay (typ.) — 0.4 ns
Speed Grade — -2
Lead Free Status / RoHS — RoHS non-compliant (per third-party listing)
Configuration Method — SRAM-based, requires external configuration device (EPC2/EPC8)
In-System Programmability — Yes (via JTAG or serial interface)

Datenblätter & Ressourcen

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