EPF10K200SBC356-3 vs EPF10K200SBC356-2X 对比
详细并排对比 EPF10K200SBC356-3 出自 Intel 和 EPF10K200SBC356-2X 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Intel
EPF10K200SBC356-2X - FLEX 10K 200K Gates FPGA, 274 I/O, 356-BGA | Intel/Altera
EPF10K200SBC356-2X Nrnd规格对比
| 参数 | EPF10K200SBC356-3 | EPF10K200SBC356-2X |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | Obsolete | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $87.50 | $295.00 |
| Family | FLEX 10K | FLEX 10K |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Typical Gates | 200,000 | — |
| Logic Elements (Cells) | 9,984 | — |
| Logic Array Blocks (LABs) | 1,248 | 1248 |
| Embedded Array Blocks (EABs) | 12 | — |
| Total EAB RAM | 98,304 bits | — |
| User I/Os | 470 (package exposes 274 bonded-out) | — |
| Flip-Flops | 4,992 | — |
| Process Technology | 0.22 um CMOS, 4 metal layers | CMOS 0.22 µm |
| Core Supply Voltage | 2.375 V to 2.625 V | — |
| Propagation Delay | 0.4 ns | — |
| Internal Performance (fmax) | 250 MHz | — |
| 工作温度 | 0 C to 70 C (Commercial) | 0 °C to +70 °C (commercial) |
| 封装 | PBGA-356 (35 x 35 mm, 1.27 mm pitch) | 356-LBGA (35x35 mm, 1.27 mm pitch) |
| 安装类型 | Surface Mount | Surface Mount |
| Configuration Mode | Passive Serial / Passive Parallel / JTAG | — |
| MultiVolt I/O | 2.5 V / 3.3 V / 5.0 V | — |
| Logic Family | CMOS | — |
| RoHS 状态 | [DATA_NEEDED: rohs status] | — |
| Series | — | FLEX-10KS |
| Logic Elements / Cells | — | 9984 |
| Approximate Gate Count | — | 200,000 |
| User I/O Count | — | 274 |
| 电源电压 | — | 2.375 V to 2.625 V (core) |
| Propagation Delay (typ.) | — | 0.4 ns |
| Speed Grade | — | -2 |
| Lead Free Status / RoHS | — | RoHS non-compliant (per third-party listing) |
| Configuration Method | — | SRAM-based, requires external configuration device (EPC2/EPC8) |
| In-System Programmability | — | Yes (via JTAG or serial interface) |