EPF10K250EFC672-3 vs EPF10K250EFC672-2 Vergleich

Detaillierter Direktvergleich von EPF10K250EFC672-3 von Intel und EPF10K250EFC672-2 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EPF10K250EFC672-3 EPF10K250EFC672-2
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $99,50 $108,00
Product Type FPGA (Field Programmable Gate Array) —
Family FLEX 10KE FLEX 10KE
Maximum Typical Gates 250,000 —
Logic Elements (LEs) 12,160 —
Embedded Memory (EAB) 655,360 bits (80 EABs x 2,048 bits each) —
Logic Array Blocks (LABs) 392 (8 LEs per LAB) —
User I/O Pins 470 —
Core Supply Voltage 2.5 V 2.3 V (typical 2.5 V)
I/O Supply Voltage MultiVolt: 1.5 V / 1.8 V / 2.5 V / 3.3 V —
Speed Grade -3 (fastest) —
Temperature Grade Commercial (0C to +70C) —
Gehäuse 672-ball FineLine BGA (FC) 672-BGA (FineLine BGA), 45 x 45 mm, 1.27 mm pitch
Ball Pitch 1.0 mm —
Configuration Mode JTAG (IEEE 1149.1) ISP / serial / parallel, external EPCx PROM —
Process Technology 0.25 um CMOS, 5-layer metal —
Montageart Surface Mount Surface Mount
RoHS-Status [DATA_NEEDED: RoHS status - 672-FBGA part is non-RoHS per Fly-Wing listing] Non-RoHS Compliant (per Fly-Wing listing)
Lead-Free [DATA_NEEDED: lead-free status] —
Logic Elements — 12,480
Typical Gates — 250,000
Embedded Array Blocks (EABs) — 20
Maximum User RAM Bits — 40,960
User I/Os — 470
Pin-Anzahl — 672
Propagation Delay — 0.4 ns
Betriebstemperatur — 0 C to +70 C (Commercial)
I/O Standard Support — 1.8 V, 2.5 V, 3.3 V (multi-volt I/O)
Logic Family — CMOS, SRAM-based
Configuration — SRAM, in-system programmable (ISP) via JTAG
Boundary Scan — IEEE 1149.1 (JTAG) compliant

Datenblätter & Ressourcen

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