EPF10K250EFC672-3 vs EPF10K250EFC672-2 Comparison

Detailed side-by-side comparison of EPF10K250EFC672-3 by Intel and EPF10K250EFC672-2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K250EFC672-3 EPF10K250EFC672-2
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $99.50 $108.00
Product Type FPGA (Field Programmable Gate Array) β€”
Family FLEX 10KE FLEX 10KE
Maximum Typical Gates 250,000 β€”
Logic Elements (LEs) 12,160 β€”
Embedded Memory (EAB) 655,360 bits (80 EABs x 2,048 bits each) β€”
Logic Array Blocks (LABs) 392 (8 LEs per LAB) β€”
User I/O Pins 470 β€”
Core Supply Voltage 2.5 V 2.3 V (typical 2.5 V)
I/O Supply Voltage MultiVolt: 1.5 V / 1.8 V / 2.5 V / 3.3 V β€”
Speed Grade -3 (fastest) β€”
Temperature Grade Commercial (0C to +70C) β€”
Package 672-ball FineLine BGA (FC) 672-BGA (FineLine BGA), 45 x 45 mm, 1.27 mm pitch
Ball Pitch 1.0 mm β€”
Configuration Mode JTAG (IEEE 1149.1) ISP / serial / parallel, external EPCx PROM β€”
Process Technology 0.25 um CMOS, 5-layer metal β€”
Mounting Type Surface Mount Surface Mount
RoHS Status [DATA_NEEDED: RoHS status - 672-FBGA part is non-RoHS per Fly-Wing listing] Non-RoHS Compliant (per Fly-Wing listing)
Lead-Free [DATA_NEEDED: lead-free status] β€”
Logic Elements β€” 12,480
Typical Gates β€” 250,000
Embedded Array Blocks (EABs) β€” 20
Maximum User RAM Bits β€” 40,960
User I/Os β€” 470
Pin Count β€” 672
Propagation Delay β€” 0.4 ns
Operating Temperature β€” 0 C to +70 C (Commercial)
I/O Standard Support β€” 1.8 V, 2.5 V, 3.3 V (multi-volt I/O)
Logic Family β€” CMOS, SRAM-based
Configuration β€” SRAM, in-system programmable (ISP) via JTAG
Boundary Scan β€” IEEE 1149.1 (JTAG) compliant

Datasheets & Resources

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