EPM2210F256C3N vs EPM2210F256C4N Vergleich
Detaillierter Direktvergleich von EPM2210F256C3N von Intel und EPM2210F256C4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPM2210F256C3N | EPM2210F256C4N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $47,10 | $39,85 |
| Series | MAX II | — |
| Device Type | CPLD (Complex Programmable Logic Device) | CPLD |
| Programmable Type | In System Programmable (JTAG, IEEE 1149.1) | — |
| Macrocells | 1700 | — |
| Logic Elements / Blocks | 2210 | — |
| Number of User I/Os | 204 | — |
| Maximum Propagation Delay (tPD) | 7 ns | — |
| Maximum Internal Frequency (fMAX) | 304 MHz | — |
| Internal Supply Voltage | 2.5 V / 3.3 V (on-chip regulator allows single 3.3 V rail) | — |
| I/O Standard Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V LVCMOS (MultiVolt) | — |
| User Flash Memory | 8 Kbits | 204 Kbit |
| Configuration Memory | On-chip flash (non-volatile, instant-on) | — |
| Betriebs-Sperrschichttemperatur | 0 C to 85 C (commercial, TJ suffix 'C') | — |
| Gehäuse | 256-ball FineLine BGA (FBGA), 17 x 17 mm, 1.0 mm pitch | 256-ball FineLine BGA (FBGA) |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Process Technology | 0.18 um flash CMOS | 0.18 µm |
| RoHS-Status | Compliant (per DigiKey product page) | Compliant |
| MSL-Level | 3 (per JEDEC J-STD-020, typical for FBGA) | — |
| Family | — | MAX II |
| Logic Elements (LE) | — | 2210 |
| Macro Cells | — | 1700 |
| Maximum Internal Frequency | — | 247.5 MHz |
| Pin-to-Pin Propagation Delay (tPD) | — | 7.0 ns |
| Maximum User I/O Pins | — | 212 (varies with package) |
| Global Clock Networks | — | 4 |
| Core Supply Voltage | — | 3.0 V to 3.6 V (3.3 V typical) |
| MultiVolt I/O Standards | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V LVTTL/LVCMOS, PCI 66 MHz |
| Betriebstemperaturbereich | — | 0 °C to +85 °C (Commercial) |
| Programming Interface | — | JTAG IEEE Std. 1149.1 + ISP |
| Lead-Free | — | Yes |