EPM2210F256C3N vs EPM2210F256C4N 比較
詳細な並列比較: EPM2210F256C3N メーカー: Intel および EPM2210F256C4N メーカー: Intel。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。
仕様比較
| パラメータ | EPM2210F256C3N | EPM2210F256C4N |
|---|---|---|
| ブランド | Intel | Intel |
| カテゴリ | FPGA & CPLD | FPGA & CPLD |
| ライフサイクル状態 | 有効 | 有効 |
| 在庫状況 | In Stock | In Stock |
| 単価（USD） | $47.10 | $39.85 |
| Series | MAX II | — |
| Device Type | CPLD (Complex Programmable Logic Device) | CPLD |
| Programmable Type | In System Programmable (JTAG, IEEE 1149.1) | — |
| Macrocells | 1700 | — |
| Logic Elements / Blocks | 2210 | — |
| Number of User I/Os | 204 | — |
| Maximum Propagation Delay (tPD) | 7 ns | — |
| Maximum Internal Frequency (fMAX) | 304 MHz | — |
| Internal Supply Voltage | 2.5 V / 3.3 V (on-chip regulator allows single 3.3 V rail) | — |
| I/O Standard Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V LVCMOS (MultiVolt) | — |
| User Flash Memory | 8 Kbits | 204 Kbit |
| Configuration Memory | On-chip flash (non-volatile, instant-on) | — |
| 動作接合温度 | 0 C to 85 C (commercial, TJ suffix 'C') | — |
| パッケージ | 256-ball FineLine BGA (FBGA), 17 x 17 mm, 1.0 mm pitch | 256-ball FineLine BGA (FBGA) |
| 実装タイプ | Surface Mount | Surface Mount (BGA) |
| Process Technology | 0.18 um flash CMOS | 0.18 µm |
| RoHS ステータス | Compliant (per DigiKey product page) | Compliant |
| MSLレベル | 3 (per JEDEC J-STD-020, typical for FBGA) | — |
| Family | — | MAX II |
| Logic Elements (LE) | — | 2210 |
| Macro Cells | — | 1700 |
| Maximum Internal Frequency | — | 247.5 MHz |
| Pin-to-Pin Propagation Delay (tPD) | — | 7.0 ns |
| Maximum User I/O Pins | — | 212 (varies with package) |
| Global Clock Networks | — | 4 |
| Core Supply Voltage | — | 3.0 V to 3.6 V (3.3 V typical) |
| MultiVolt I/O Standards | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V LVTTL/LVCMOS, PCI 66 MHz |
| 動作温度範囲 | — | 0 °C to +85 °C (Commercial) |
| Programming Interface | — | JTAG IEEE Std. 1149.1 + ISP |
| Lead-Free | — | Yes |