EPM2210F256C3N vs EPM2210F256C4N 비교
다음의 상세 나란히 비교: EPM2210F256C3N 제조: Intel 및 EPM2210F256C4N 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | EPM2210F256C3N | EPM2210F256C4N |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $47.10 | $39.85 |
| Series | MAX II | — |
| Device Type | CPLD (Complex Programmable Logic Device) | CPLD |
| Programmable Type | In System Programmable (JTAG, IEEE 1149.1) | — |
| Macrocells | 1700 | — |
| Logic Elements / Blocks | 2210 | — |
| Number of User I/Os | 204 | — |
| Maximum Propagation Delay (tPD) | 7 ns | — |
| Maximum Internal Frequency (fMAX) | 304 MHz | — |
| Internal Supply Voltage | 2.5 V / 3.3 V (on-chip regulator allows single 3.3 V rail) | — |
| I/O Standard Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V LVCMOS (MultiVolt) | — |
| User Flash Memory | 8 Kbits | 204 Kbit |
| Configuration Memory | On-chip flash (non-volatile, instant-on) | — |
| 동작 접합 온도 | 0 C to 85 C (commercial, TJ suffix 'C') | — |
| 패키지 | 256-ball FineLine BGA (FBGA), 17 x 17 mm, 1.0 mm pitch | 256-ball FineLine BGA (FBGA) |
| 실장 유형 | Surface Mount | Surface Mount (BGA) |
| Process Technology | 0.18 um flash CMOS | 0.18 µm |
| RoHS 상태 | Compliant (per DigiKey product page) | Compliant |
| MSL 레벨 | 3 (per JEDEC J-STD-020, typical for FBGA) | — |
| Family | — | MAX II |
| Logic Elements (LE) | — | 2210 |
| Macro Cells | — | 1700 |
| Maximum Internal Frequency | — | 247.5 MHz |
| Pin-to-Pin Propagation Delay (tPD) | — | 7.0 ns |
| Maximum User I/O Pins | — | 212 (varies with package) |
| Global Clock Networks | — | 4 |
| Core Supply Voltage | — | 3.0 V to 3.6 V (3.3 V typical) |
| MultiVolt I/O Standards | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V LVTTL/LVCMOS, PCI 66 MHz |
| 동작 온도 범위 | — | 0 °C to +85 °C (Commercial) |
| Programming Interface | — | JTAG IEEE Std. 1149.1 + ISP |
| Lead-Free | — | Yes |