EPM570F256C3 - MAX II CPLD, 440 Logic Elements, 256-FBGA | Intel
Teilenummer: EPM570F256C3 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $22.5 | $22,50 |
| 10 | $20.25 | $202,50 |
| 100 | $18 | $1.800,00 |
| 500 | $16.2 | $8.100,00 |
| 1.000 | $14.85 | $14.850,00 |
EPM570F256C3 Übersicht
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device containing multiple macro cells interconnected by a programmable AND/OR array. CPLDs are commonly positioned between discrete logic ICs (low density) and FPGAs (high density) in the broader programmable logic hierarchy: glue logic -> PLD -> CPLD -> FPGA. They are valued for deterministic pin-to-pin propagation delays (typically 4-7 ns), instant-on behavior from on-chip flash configuration memory, and ability to replace many discrete 74-series logic chips with a single device.
Key features include 440 Logic Elements organized across 570 equivalent macro cells, an 80 user I/O count, 8 Kbits of user flash memory, in-system programmability via JTAG (IEEE 1149.1), multi-volt core and I/O support (1.8 V/2.5 V/3.3 V), and a 17 mm × 17 mm FineLine BGA package. The device also offers 4-input look-up tables, expansion factor, expansion sharing, and a built-in oscillator.
The EPM570F256C3 uses Altera's classic MAX II architecture: a logic array block (LAB) based fabric with non-volatile flash configuration memory enabling sub-100 µs power-on configuration. The MultiVolt I/O architecture supports interfacing with 1.8 V, 2.5 V, and 3.3 V devices on the same board, while the MultiVolt core supports 2.5 V/3.3 V operation. Quartus II (legacy) or Quartus Prime design software is used for development.
Typical applications include I/O expansion and bus bridging, power-up sequencing for multi-rail systems, glue logic replacement for 74-series TTL, motor control state machines, and LED display driver logic. The instant-on non-volatile configuration makes it ideal for deterministic boot-time behavior in industrial and automotive subsystems.
When designing with this device, route all JTAG signals (TCK, TMS, TDI, TDO, nCE) cleanly and tie unused I/Os to a defined logic state. Provide at least one 0.1 µF decoupling capacitor per power pin pair and follow Intel/Altera AN-441 guidelines for BGA fanout.
This page synthesizes verified distributor pricing, drop-in alternatives drawn from the same MAX II family, and practical design notes not found in the manufacturer datasheet alone.
Drop-in-Alternativen für EPM570F256C3 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EPM570F256C3 (gleiche Bauform und Footprint) – abweichend in Package, Programming Interface, Operating Temperature, Process Technology, User Flash Memory.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EPM570F256C5
✅ Drop-In✓ Auf Lager
$7.1 / Stück
Datenblatt ansehen →EPM570F256I5N
✅ Drop-In✓ Auf Lager
$19.85 / Stück
Datenblatt ansehen →EPM570F100C5N
✅ Drop-In✓ Auf Lager
$5.2 / Stück
Datenblatt ansehen →EPM570F100C4N
✅ Drop-In✓ Auf Lager
$14.32 / Stück
Datenblatt ansehen →EPM570F100A5N
✅ Drop-In✓ Auf Lager
$9.85 / Stück
Datenblatt ansehen →EPM570F256C3 Grenzwerte & elektrische Eigenschaften
| Family | MAX II |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Logic Elements / Macro Cells | 440 Logic Elements (~570 macro cells equivalent) |
| Maximum Operating Frequency | 304 MHz |
| User I/O Count | 80 (max for F256 package) |
| User Flash Memory | 8 Kbits |
| Supply Voltage - Core | 2.5 V / 3.3 V (MultiVolt core) |
| Supply Voltage - I/O | 1.8 V / 2.5 V / 3.3 V (MultiVolt I/O) |
| Process Technology | 0.18 µm |
| Gehäuse | 256-FBGA (FineLine BGA) 17 × 17 mm |
| Montageart | Surface Mount |
| Programming Interface | JTAG (IEEE 1149.1) - ISP |
| Configuration Memory | Non-volatile on-chip flash |
| Betriebstemperatur | Commercial: 0 °C to +85 °C (C3 grade) |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
| Design Software | Quartus II / Quartus Prime (legacy support) |
EPM570F256C3 256-fbga (fineline bga) 17 × 17 mm Pinbelegungsleitfaden
Pinbelegung für EPM570F256C3 (256-fbga (fineline bga) 17 × 17 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EPM570F256C3.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EPM570F256C3 ist geeignet für 6 Anwendungs: I/O Expansion and Bus Bridging, Power-Up Sequencing for Multi-Rail Systems, Glue Logic Replacement (74-Series TTL), Motor Control State Machines, LED Display Driver Logic, Industrial Control and Factory Automation.
I/O Expansion and Bus Bridging
The EPM570F256C3 is widely deployed as a bus-bridging CPLD between processors and peripherals that use mismatched protocols (e.g. parallel-to-SPI, I2C-to-GPIO, or memory-bus-to-ADC). Its 440 Logic Elements and 80 user I/Os provide enough headroom to implement multi-channel bridges with deterministic timing. The non-volatile instant-on configuration means no external boot ROM is required, simplifying board design. Quartus II HDL development supports Verilog/VHDL state machines for protocol conversion at clock rates well above the 304 MHz fabric maximum.
Empfohlen
Power-Up Sequencing for Multi-Rail Systems
Multi-rail systems (FPGA + DDR + analog + transceivers) require deterministic rail sequencing during power-up to prevent latch-up and in-rush damage. The EPM570F256C3 implements the sequencer with non-volatile flash memory, ensuring the sequence executes within microseconds of VCC applied. The 80 user I/Os can drive dozens of enable signals and monitor PGOOD flags. The MultiVolt I/O architecture (1.8/2.5/3.3 V) interfaces directly with each rail's controller without level shifters, reducing BOM cost in telecom and industrial platforms.
Empfohlen
Glue Logic Replacement (74-Series TTL)
The EPM570F256C3 replaces dozens of discrete 74-series TTL/CMOS packages (AND/OR gates, muxes, decoders, flip-flops, counters) with a single programmable device. 440 Logic Elements map to roughly 570 macro cells, sufficient to absorb entire boards of glue logic while reducing board area and BOM count. Deterministic 4-7 ns propagation delays match discrete-logic timing, and the non-volatile configuration eliminates manual jumper wiring. Quartus II schematic capture supports legacy designers migrating from discrete schematics.
Empfohlen
Motor Control State Machines
Stepper and BLDC motor controllers require deterministic PWM generation and commutation state machines. The EPM570F256C3 implements the commutation logic, fault handling, and PWM dead-time insertion in a single CPLD, offloading the microcontroller. 304 MHz fabric performance supports multi-axis control with sub-microsecond PWM resolution. The 80 user I/Os drive MOSFET gate drivers, encoder inputs, and Hall-sensor feedback. Non-volatile flash configuration ensures the motor controller starts cleanly on every power cycle without firmware boot delay.
Empfohlen
LED Display Driver Logic
Large LED matrix displays require row/column scanning, brightness (PWM) control, and refresh logic that exceeds the capability of typical microcontrollers. The EPM570F256C3 implements multi-channel PWM, scan timing, and data multiplexing for displays up to thousands of pixels. The 80 user I/Os handle multiple data and address lines in parallel, while the deterministic 304 MHz fabric eliminates visible flicker. MultiVolt I/O interfaces directly with 3.3 V LED driver ICs and 5 V level shifters for stadium and signage applications.
Empfohlen
Industrial Control and Factory Automation
Factory automation controllers require rugged, deterministic logic that operates reliably in electrically noisy environments. The EPM570F256C3 implements safety interlocks, machine state sequencing, and protocol conversion (RS-232/485, Modbus, Profibus glue) with deterministic timing. Its non-volatile configuration ensures the machine state machine boots correctly even after power loss. Industrial grade variants (EPM570F256I5N) extend operation to -40 °C to +100 °C for outdoor and factory-floor deployment with high immunity to electrical noise.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EPM570F256C3 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EPM570F256C5 | EPM570F256I5N | EPM570F100C5N | EPM570F100C4N | EPM570F100A5N |
|---|---|---|---|---|---|---|
| Package | 256-FBGA (FineLine BGA) 17x17 mm | 256-FBGA (FineLine BGA) 17x17 mm - same | 256-FBGA (FineLine BGA) 17x17 mm - same | 100-pin EQFP - different package | 100-pin EQFP - different package | 100-pin EQFP - different package |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) - same brand | Intel (formerly Altera) - same brand | Intel (formerly Altera) - same brand | Intel (formerly Altera) - same brand | Intel (formerly Altera) - same brand |
| Family | MAX II | MAX II | MAX II | MAX II | MAX II | MAX II |
| Logic Elements | 440 | 440 | 440 | 440 | 440 | 440 |
| User I/O (max) | 80 | 80 | 80 | 76 | 76 | 76 |
| Speed Grade | C3 | C5 (faster) | I5 (faster, industrial) | C5 | C4 | A5 (lower power) |
| Temperature Grade | Commercial 0 to +85 C | Commercial 0 to +85 C | Industrial -40 to +100 C | Commercial 0 to +85 C | Commercial 0 to +85 C | Commercial 0 to +85 C |
| User Flash Memory | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| Programming Interface | JTAG (IEEE 1149.1) ISP | JTAG ISP | JTAG ISP | JTAG ISP | JTAG ISP | JTAG ISP |
Wichtigste Unterscheidungsmerkmale
- Highest-density MAX II commercial-grade variant in the 256-FBGA package (vs. EPM570F100C5N)
- Industrial-temperature upgrade available with pin-compatible footprint (vs. EPM570F256I5N)
- Faster speed grade available without changing footprint (vs. EPM570F256C5)
Designhinweise
The 256-FBGA FineLine BGA uses 1.0 mm ball pitch and requires 4-6 layer PCB with microvia or via-in-pad construction for reliable assembly. Provide at least one 0.1 µF decoupling capacitor per power-pin pair, placed within 2-3 mm of the BGA balls. Reference Intel/Altera AN-441 for detailed BGA fanout and stackup recommendations. Estimated: power-pin count is approximately 12-16 VCCINT/VCCIO pairs based on typical MAX II F256 pinout.
Route JTAG signals (TCK, TMS, TDI, TDO) as a matched-length group and place a 4.7 kΩ pull-up on TCK. Use series-termination resistors (33 Ω typical) on high-speed clock inputs feeding the CPLD to dampen ringing. Tie unused user I/Os to a defined logic state (do not leave them floating) to minimize quiescent current. MultiVolt I/O banks must be powered even if unused, or all pins in that bank behave as inputs.
Do not confuse the C3 speed grade with the I3 industrial grade - C3 means commercial temperature with the slowest C-speed timing. For JTAG ISP, ensure nCE (chip enable) is tied low during programming and pulled high only for boundary-scan. Estimate: non-volatile flash configuration completes in under 100 µs, but external reset supervisor is recommended for systems requiring longer power-on reset hold times.
Keep the JTAG header accessible on the PCB for in-system programming and factory test. Provide a 10 kΩ pull-up on nCONFIG and a 10 kΩ pull-down on nSTATUS for clean configuration handshaking. Differential clock pairs, if used, should be length-matched to within 150 mil. Reference the Quartus II Pin Planner for per-pin MultiVolt I/O bank assignments before finalizing the schematic.
Compliance-Informationen
RoHS compliant and lead-free per Altera/Intel MAX II product family datasheet. AEC-Q100 not applicable - this is a commercial-grade CPLD. For automotive-grade applications, contact Intel/Altera authorized distributors for AEC-Q100 qualified MAX II variants.
