EPM570F256I5 vs EPM570F256C3N Vergleich
Detaillierter Direktvergleich von EPM570F256I5 von Intel und EPM570F256C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPM570F256I5 | EPM570F256C3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $12,60 | $13,75 |
| Family | MAX II | MAX II |
| Logic Elements (LE) | 570 | — |
| Maximum User I/O Pins | 160 | — |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Number of LABs/CLBs | [DATA_NEEDED: number of LABs] | — |
| Package Type | 256-ball FineLine BGA (FBGA-256) | — |
| Betriebstemperatur | -40C to +85C (industrial) | — |
| Supply Voltage - Core | 3.3 V (also operates at 3.3V per part description) | — |
| I/O Standards Supported | LVTTL, LVCMOS, SSTL, PCI | — |
| MultiVolt I/O | 1.5V / 1.8V / 2.5V / 3.3V | — |
| Programming Interface | JTAG (IEEE 1149.1) / ISP | JTAG (IEEE 1532 / IEEE 1149.1) + ISP |
| In-System Programmability | Yes | — |
| Non-volatile Configuration | Yes (on-chip flash) | — |
| Pin-to-Pin Logic Delay (typ) | 5 ns to 7 ns | — |
| Maximum Internal Frequency | [DATA_NEEDED: fMAX MHz per speed grade] | — |
| Number of PLLs | [DATA_NEEDED: number of PLLs] | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant (per DigiKey listing) |
| Width | 17 mm (per Partstack) | — |
| Speed Grade | I5 | — |
| Logic Elements (LEs) | — | 570 |
| Equivalent Macrocells | — | 440 |
| Maximum Operating Frequency | — | 304 MHz |
| Process Technology | — | 0.18 um, 6-layer-metal flash CMOS |
| Core Voltage | — | 2.5 V / 3.3 V |
| I/O Voltage Support (MultiVolt) | — | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| Gehäuse | — | 256-ball FBGA (FineLine BGA) |
| User I/O Count | — | [DATA_NEEDED: confirm exact user-IO count for F256 package] |
| Operating Temperature (C3 grade) | — | 0 C to +85 C (commercial) |
| MSL-Level | — | [DATA_NEEDED: MSL level not stated in provided data] |
| Lead-Free | — | Yes (per suffix 'N' convention) |
| Typical Macroscopic Functions | — | Glue logic, bus bridging, I/O expansion, power sequencing |