EPM570F256I5 vs EPM570F256C3N 对比

详细并排对比 EPM570F256I5 出自 Intel 和 EPM570F256C3N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EPM570F256I5 EPM570F256C3N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 不推荐新设计 有效
库存状态 有库存 有库存
单价(USD) $12.60 $13.75
Family MAX II MAX II
Logic Elements (LE) 570 —
Maximum User I/O Pins 160 —
User Flash Memory (UFM) 8 Kbits 8 Kbits
Number of LABs/CLBs [DATA_NEEDED: number of LABs] —
Package Type 256-ball FineLine BGA (FBGA-256) —
工作温度 -40C to +85C (industrial) —
Supply Voltage - Core 3.3 V (also operates at 3.3V per part description) —
I/O Standards Supported LVTTL, LVCMOS, SSTL, PCI —
MultiVolt I/O 1.5V / 1.8V / 2.5V / 3.3V —
Programming Interface JTAG (IEEE 1149.1) / ISP JTAG (IEEE 1532 / IEEE 1149.1) + ISP
In-System Programmability Yes —
Non-volatile Configuration Yes (on-chip flash) —
Pin-to-Pin Logic Delay (typ) 5 ns to 7 ns —
Maximum Internal Frequency [DATA_NEEDED: fMAX MHz per speed grade] —
Number of PLLs [DATA_NEEDED: number of PLLs] —
安装类型 Surface Mount Surface Mount
RoHS 状态 [DATA_NEEDED: RoHS status] Compliant (per DigiKey listing)
Width 17 mm (per Partstack) —
Speed Grade I5 —
Logic Elements (LEs) — 570
Equivalent Macrocells — 440
Maximum Operating Frequency — 304 MHz
Process Technology — 0.18 um, 6-layer-metal flash CMOS
Core Voltage — 2.5 V / 3.3 V
I/O Voltage Support (MultiVolt) — 1.5 V, 1.8 V, 2.5 V, 3.3 V
封装 — 256-ball FBGA (FineLine BGA)
User I/O Count — [DATA_NEEDED: confirm exact user-IO count for F256 package]
Operating Temperature (C3 grade) — 0 C to +85 C (commercial)
MSL 等级 — [DATA_NEEDED: MSL level not stated in provided data]
Lead-Free — Yes (per suffix 'N' convention)
Typical Macroscopic Functions — Glue logic, bus bridging, I/O expansion, power sequencing

数据手册与资源

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