EPM570F256I5 vs EPM570F256C3N Comparación
Comparación detallada lado a lado de EPM570F256I5 por Intel y EPM570F256C3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPM570F256I5 | EPM570F256C3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $12,60 | $13,75 |
| Family | MAX II | MAX II |
| Logic Elements (LE) | 570 | — |
| Maximum User I/O Pins | 160 | — |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Number of LABs/CLBs | [DATA_NEEDED: number of LABs] | — |
| Package Type | 256-ball FineLine BGA (FBGA-256) | — |
| Temperatura de funcionamiento | -40C to +85C (industrial) | — |
| Supply Voltage - Core | 3.3 V (also operates at 3.3V per part description) | — |
| I/O Standards Supported | LVTTL, LVCMOS, SSTL, PCI | — |
| MultiVolt I/O | 1.5V / 1.8V / 2.5V / 3.3V | — |
| Programming Interface | JTAG (IEEE 1149.1) / ISP | JTAG (IEEE 1532 / IEEE 1149.1) + ISP |
| In-System Programmability | Yes | — |
| Non-volatile Configuration | Yes (on-chip flash) | — |
| Pin-to-Pin Logic Delay (typ) | 5 ns to 7 ns | — |
| Maximum Internal Frequency | [DATA_NEEDED: fMAX MHz per speed grade] | — |
| Number of PLLs | [DATA_NEEDED: number of PLLs] | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant (per DigiKey listing) |
| Width | 17 mm (per Partstack) | — |
| Speed Grade | I5 | — |
| Logic Elements (LEs) | — | 570 |
| Equivalent Macrocells | — | 440 |
| Maximum Operating Frequency | — | 304 MHz |
| Process Technology | — | 0.18 um, 6-layer-metal flash CMOS |
| Core Voltage | — | 2.5 V / 3.3 V |
| I/O Voltage Support (MultiVolt) | — | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| Encapsulado | — | 256-ball FBGA (FineLine BGA) |
| User I/O Count | — | [DATA_NEEDED: confirm exact user-IO count for F256 package] |
| Operating Temperature (C3 grade) | — | 0 C to +85 C (commercial) |
| Nivel MSL | — | [DATA_NEEDED: MSL level not stated in provided data] |
| Lead-Free | — | Yes (per suffix 'N' convention) |
| Typical Macroscopic Functions | — | Glue logic, bus bridging, I/O expansion, power sequencing |