H5ANAG6NCMR-XNC vs H5ANAG6NAMR-UHC Vergleich
Detaillierter Direktvergleich von H5ANAG6NCMR-XNC von SK hynix und H5ANAG6NAMR-UHC von SK hynix. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | H5ANAG6NCMR-XNC | H5ANAG6NAMR-UHC |
|---|---|---|
| Marke | SK hynix | SK hynix |
| Kategorie | Memory ICs | Memory ICs |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $31,40 | $4,50 |
| Speichertyp | DDR4 SDRAM (Volatile DRAM) | DDR4 SDRAM |
| Speichergröße | 16 Gb | — |
| Memory Organization | 1G x 16 | — |
| Datenrate | 3200 Mbps/pin | — |
| Supply Voltage (VDD) | 1.2 V | 1.2 V |
| Technology | CMOS | — |
| Power Class | Normal Power | Normal Power |
| Schnittstelle | Parallel | — |
| Speed Grade | XN (3200) | — |
| Gehäuse | FBGA-96 | FBGA-96 (PBGA96) |
| Montageart | Surface Mount | Surface Mount (BGA solder ball) |
| Product Status | Active | — |
| RoHS-Status | RoHS Compliant | [DATA_NEEDED: RoHS status] |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Refresh | [DATA_NEEDED: refresh rate] | Self-refresh and auto-refresh (DDR4 standard 64 ms) |
| CAS-Latenz | [DATA_NEEDED: CAS latency at 3200] | [DATA_NEEDED: CL for UHC bin] |
| MSL-Level | [DATA_NEEDED: moisture sensitivity level] | — |
| Memory Density | — | 16 Gbit (2 GB) |
| Speicherorganisation | — | 1G x 16 |
| Speed Grade / Data Rate | — | DDR4-2400 (UHC bin, PC4-19200) |
| Architecture | — | CMOS DDR4 with bank groups |
| Schnittstellentyp | — | Parallel, synchronous, double data rate |
| Available Speed Bins (family) | — | PB / RD / TF / UH / VK |
| Application Class | — | Main memory, embedded, industrial |
| Lebenszyklusstatus | — | Active production |