H5ANAG6NCMR-XNC vs H5ANAG6NAMR-UHC 对比
详细并排对比 H5ANAG6NCMR-XNC 出自 SK hynix 和 H5ANAG6NAMR-UHC 出自 SK hynix。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | H5ANAG6NCMR-XNC | H5ANAG6NAMR-UHC |
|---|---|---|
| 品牌 | SK hynix | SK hynix |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $31.40 | $4.50 |
| 存储器类型 | DDR4 SDRAM (Volatile DRAM) | DDR4 SDRAM |
| 存储容量 | 16 Gb | — |
| Memory Organization | 1G x 16 | — |
| 数据速率 | 3200 Mbps/pin | — |
| Supply Voltage (VDD) | 1.2 V | 1.2 V |
| Technology | CMOS | — |
| Power Class | Normal Power | Normal Power |
| 接口 | Parallel | — |
| Speed Grade | XN (3200) | — |
| 封装 | FBGA-96 | FBGA-96 (PBGA96) |
| 安装类型 | Surface Mount | Surface Mount (BGA solder ball) |
| Product Status | Active | — |
| RoHS 状态 | RoHS Compliant | [DATA_NEEDED: RoHS status] |
| 工作温度 | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Refresh | [DATA_NEEDED: refresh rate] | Self-refresh and auto-refresh (DDR4 standard 64 ms) |
| CAS 延迟 | [DATA_NEEDED: CAS latency at 3200] | [DATA_NEEDED: CL for UHC bin] |
| MSL 等级 | [DATA_NEEDED: moisture sensitivity level] | — |
| Memory Density | — | 16 Gbit (2 GB) |
| 存储组织 | — | 1G x 16 |
| Speed Grade / Data Rate | — | DDR4-2400 (UHC bin, PC4-19200) |
| Architecture | — | CMOS DDR4 with bank groups |
| 接口类型 | — | Parallel, synchronous, double data rate |
| Available Speed Bins (family) | — | PB / RD / TF / UH / VK |
| Application Class | — | Main memory, embedded, industrial |
| 生命周期状态 | — | Active production |