H5TC4G63AFR-PBJ vs H5TC4G63AFR-PBA Vergleich
Detaillierter Direktvergleich von H5TC4G63AFR-PBJ von SK hynix und H5TC4G63AFR-PBA von SK hynix. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | H5TC4G63AFR-PBJ | H5TC4G63AFR-PBA |
|---|---|---|
| Marke | SK hynix | SK hynix |
| Kategorie | Memory ICs | Memory ICs |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $7,50 | $3,98 |
| Speichertyp | DDR3L SDRAM | DDR3L SDRAM |
| Speichergröße | 4 Gb (256M x 16) | — |
| Versorgungsspannung | 1.35 V | — |
| Gehäuse | 96-ball TFBGA | 96-ball FBGA |
| Temperature Grade | Industrial (-40°C to +95°C) | — |
| Refresh Cycles | 8192 | — |
| Package Shape | Rectangular | — |
| Number of Terminals | 96 | — |
| Datenrate | [DATA_NEEDED: Data rate (e.g., 1600 Mbps)] | 1866 Mbps (PC3L-14900) |
| CAS-Latenz | [DATA_NEEDED: CAS Latency] | — |
| Access Time | 0.225 ns (from H5TC4G63AFR-PBR datasheet) | — |
| Auto Self-Refresh | Yes | Yes |
| Data Mask | Yes | — |
| Auto Precharge | Yes | — |
| Asynchronous Reset | Yes | — |
| Dynamic On-Chip Termination | Yes | — |
| ZQ Calibration | Yes | Yes |
| Write Leveling | Yes | Yes |
| RoHS-Status | [DATA_NEEDED: RoHS Status] | — |
| Density | — | 4Gb |
| Speicherorganisation | — | 256M x 16 |
| Supply Voltage (VDD/VDDQ) | — | 1.35V |
| Ball Pitch | — | 0.8mm |
| Number of Banks | — | 8 |
| Burst Length | — | 8 and 4 (with burst chop) |
| CAS Latency (CL) | — | 11, 12, 13 |
| Betriebstemperaturbereich | — | 0°C to +95°C (Tcase) |
| Schnittstelle | — | 16-bit I/O |
| On-Die Termination (ODT) | — | Yes |
| Partial Array Self-Refresh | — | Yes |
| RoHS | — | Compliant |