IRFR5505TRPBF vs IRFR6215TRLPBF Vergleich

Detaillierter Direktvergleich von IRFR5505TRPBF von Infineon und IRFR6215TRLPBF von Infineon. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter IRFR5505TRPBF IRFR6215TRLPBF
Marke Infineon Infineon
Kategorie MOSFETs MOSFETs
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $0,48 $0,38
Manufacturer Infineon Technologies (formerly International Rectifier) —
Series HEXFET —
Polarity P-Channel P-Channel
Technology IR MOSFET (HEXFET 5th generation) HEXFET Power MOSFET (Fifth Generation)
Drain-Source Voltage (VDS) max -55 V —
Continuous Drain Current (ID) at TC=25C -18 A —
Pulsed Drain Current (IDM) -72 A [DATA_NEEDED: pulsed drain current value]
Gate-Source Voltage (VGS) max +/-20 V ±20 V
On-Resistance RDS(on) max at VGS=-10V 110 mOhm —
Total Gate Charge (Qg) 21.3 nC —
Gate-Source Charge (Qgs) [DATA_NEEDED: Qgs] —
Gate-Drain Charge (Qgd) [DATA_NEEDED: Qgd] —
Input Capacitance (Ciss) [DATA_NEEDED: Ciss] —
Output Capacitance (Coss) [DATA_NEEDED: Coss] —
Rise Time (tr) [DATA_NEEDED: tr] —
Fall Time (tf) [DATA_NEEDED: tf] —
Maximum Power Dissipation (PD) at TC=25C 57 W —
Betriebs-Sperrschichttemperatur -55 C to +175 C —
Thermal Resistance Junction-to-Case (RthJC) 2.2 C/W —
Thermal Resistance Junction-to-Ambient (RthJA) 50 C/W (typical, DPAK on 1 oz copper) —
Gehäuse TO-252AA (DPAK), surface mount TO-252AA (DPAK)
Montageart Surface Mount Surface Mount
RoHS-Status Compliant (PBF suffix) Compliant
Lead-Free Yes (PBF suffix) Yes
Drain-Source Voltage (VDS) — -150 V
Continuous Drain Current (ID) at Tc=25C — -13 A
RDS(on) max at VGS=-10V — 580 mOhm
Total Gate Charge (Qg) typ — 44 nC
Power Dissipation (PD) at Tc=25C — 110 W
Maximum Operating Junction Temperature — 175 C
MSL-Level — 1

Datenblätter & Ressourcen

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