IRFR6215TRLPBF vs IRFR5505TRPBF Vergleich
Detaillierter Direktvergleich von IRFR6215TRLPBF von Infineon und IRFR5505TRPBF von Infineon. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | IRFR6215TRLPBF | IRFR5505TRPBF |
|---|---|---|
| Marke | Infineon | Infineon |
| Kategorie | MOSFETs | MOSFETs |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,38 | $0,48 |
| Polarity | P-Channel | P-Channel |
| Drain-Source Voltage (VDS) | -150 V | — |
| Continuous Drain Current (ID) at Tc=25C | -13 A | — |
| Pulsed Drain Current (IDM) | [DATA_NEEDED: pulsed drain current value] | -72 A |
| Gate-Source Voltage (VGS) max | ±20 V | +/-20 V |
| RDS(on) max at VGS=-10V | 580 mOhm | — |
| Total Gate Charge (Qg) typ | 44 nC | — |
| Power Dissipation (PD) at Tc=25C | 110 W | — |
| Maximum Operating Junction Temperature | 175 C | — |
| Gehäuse | TO-252AA (DPAK) | TO-252AA (DPAK), surface mount |
| Montageart | Surface Mount | Surface Mount |
| Technology | HEXFET Power MOSFET (Fifth Generation) | IR MOSFET (HEXFET 5th generation) |
| MSL-Level | 1 | — |
| RoHS-Status | Compliant | Compliant (PBF suffix) |
| Lead-Free | Yes | Yes (PBF suffix) |
| Manufacturer | — | Infineon Technologies (formerly International Rectifier) |
| Series | — | HEXFET |
| Drain-Source Voltage (VDS) max | — | -55 V |
| Continuous Drain Current (ID) at TC=25C | — | -18 A |
| On-Resistance RDS(on) max at VGS=-10V | — | 110 mOhm |
| Total Gate Charge (Qg) | — | 21.3 nC |
| Gate-Source Charge (Qgs) | — | [DATA_NEEDED: Qgs] |
| Gate-Drain Charge (Qgd) | — | [DATA_NEEDED: Qgd] |
| Input Capacitance (Ciss) | — | [DATA_NEEDED: Ciss] |
| Output Capacitance (Coss) | — | [DATA_NEEDED: Coss] |
| Rise Time (tr) | — | [DATA_NEEDED: tr] |
| Fall Time (tf) | — | [DATA_NEEDED: tf] |
| Maximum Power Dissipation (PD) at TC=25C | — | 57 W |
| Betriebs-Sperrschichttemperatur | — | -55 C to +175 C |
| Thermal Resistance Junction-to-Case (RthJC) | — | 2.2 C/W |
| Thermal Resistance Junction-to-Ambient (RthJA) | — | 50 C/W (typical, DPAK on 1 oz copper) |