K4S641632K-UC75 vs K4S641632H-UC75 Vergleich

Detaillierter Direktvergleich von K4S641632K-UC75 von Samsung Electro-Mechanics und K4S641632H-UC75 von Samsung Electronics. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Samsung Electro-Mechanics
K4S641632K-UC75 K4S641632K-UC75 - 64Mb SDRAM 4Mx16 3.3V 54-TSOP II | Samsung

K4S641632K-UC75 - 64Mb SDRAM 4Mx16 3.3V 54-TSOP II | Samsung

K4S641632K-UC75 ✓ Aktiv
Samsung Electronics
K4S641632H-UC75 K4S641632H-UC75 - 64Mb H-die SDRAM 1M x 16 x 4 Banks | Samsung

K4S641632H-UC75 - 64Mb H-die SDRAM 1M x 16 x 4 Banks | Samsung

K4S641632H-UC75 Obsolete

Spezifikationsvergleich

Parameter K4S641632K-UC75 K4S641632H-UC75
Marke Samsung Electro-Mechanics Samsung Electronics
Kategorie Memory ICs Memory ICs
Lebenszyklusstatus Aktiv Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $0,92 $2,85
Speichertyp Synchronous DRAM (SDR SDRAM) SDRAM (Synchronous DRAM)
Density 64 Mbit (67,108,864 bits) 64 Mb (67,108,864 bits)
Speicherorganisation 4 banks x 1,048,576 words x 16 bits (4Mx16) 1M x 16 bits x 4 Banks
Supply Voltage (VDD/VDDQ) 3.3 V +/- 0.3 V 3.3 V
Speed Grade UC75 (133 MHz, CAS Latency 3, tCK = 7.5 ns) —
Maximale Taktfrequenz 133 MHz —
CAS Latency (CL) 2 or 3 (programmable) —
Burst Length 1, 2, 4, 8 or full page 1, 2, 4, 8, Full Page
Refresh Cycles 4096 (64 ms refresh interval) —
Number of Banks 4 —
Address Multiplexing Row: 12 bits, Column: 8 bits Yes (RAS#, CAS# controlled)
Schnittstelle 16-bit data bus, LVTTL-compatible LVCMOS
Betriebstemperatur 0 C to +70 C (Commercial) 0C to +70C (Commercial)
Gehäuse 54-pin TSOP-II —
Package Outline 10.16 mm x 22.22 mm, 0.8 mm pitch —
Montageart Surface Mount (Tape & Reel) —
Process Technology Samsung high-performance CMOS Samsung high-performance CMOS
RoHS-Status Compliant —
Clock Frequency — 133 MHz
Max Operating Current — 135 mA
Package Type — 54-pin TSOP-II
Lead Finish — Pb-Free (RoHS compliant)
Bank Architecture — 4 Banks
Burst Type — Sequential or Interleave
Refresh — Auto-Refresh and Self-Refresh
Data Width — 16 bits

Datenblätter & Ressourcen

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