K4S641632K-UC75 vs K4S641632H-UC75 对比

详细并排对比 K4S641632K-UC75 出自 Samsung Electro-Mechanics 和 K4S641632H-UC75 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Samsung Electro-Mechanics
K4S641632K-UC75 K4S641632K-UC75 - 64Mb SDRAM 4Mx16 3.3V 54-TSOP II | Samsung

K4S641632K-UC75 - 64Mb SDRAM 4Mx16 3.3V 54-TSOP II | Samsung

K4S641632K-UC75 ✓ 量产中
Samsung Electronics
K4S641632H-UC75 K4S641632H-UC75 - 64Mb H-die SDRAM 1M x 16 x 4 Banks | Samsung

K4S641632H-UC75 - 64Mb H-die SDRAM 1M x 16 x 4 Banks | Samsung

K4S641632H-UC75 Obsolete

规格对比

参数 K4S641632K-UC75 K4S641632H-UC75
品牌 Samsung Electro-Mechanics Samsung Electronics
分类 Memory ICs Memory ICs
生命周期状态 有效 Obsolete
库存状态 有库存 有库存
单价(USD) $0.92 $2.85
存储器类型 Synchronous DRAM (SDR SDRAM) SDRAM (Synchronous DRAM)
Density 64 Mbit (67,108,864 bits) 64 Mb (67,108,864 bits)
存储组织 4 banks x 1,048,576 words x 16 bits (4Mx16) 1M x 16 bits x 4 Banks
Supply Voltage (VDD/VDDQ) 3.3 V +/- 0.3 V 3.3 V
Speed Grade UC75 (133 MHz, CAS Latency 3, tCK = 7.5 ns) —
最大时钟频率 133 MHz —
CAS Latency (CL) 2 or 3 (programmable) —
Burst Length 1, 2, 4, 8 or full page 1, 2, 4, 8, Full Page
Refresh Cycles 4096 (64 ms refresh interval) —
Number of Banks 4 —
Address Multiplexing Row: 12 bits, Column: 8 bits Yes (RAS#, CAS# controlled)
接口 16-bit data bus, LVTTL-compatible LVCMOS
工作温度 0 C to +70 C (Commercial) 0C to +70C (Commercial)
封装 54-pin TSOP-II —
Package Outline 10.16 mm x 22.22 mm, 0.8 mm pitch —
安装类型 Surface Mount (Tape & Reel) —
Process Technology Samsung high-performance CMOS Samsung high-performance CMOS
RoHS 状态 Compliant —
Clock Frequency — 133 MHz
Max Operating Current — 135 mA
Package Type — 54-pin TSOP-II
Lead Finish — Pb-Free (RoHS compliant)
Bank Architecture — 4 Banks
Burst Type — Sequential or Interleave
Refresh — Auto-Refresh and Self-Refresh
Data Width — 16 bits

数据手册与资源

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