K6X1008C2D-BF70 vs K6X1008C2D-GF70 Vergleich

Detaillierter Direktvergleich von K6X1008C2D-BF70 von Samsung Electronics und K6X1008C2D-GF70 von Samsung Electronics. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Samsung Electronics
K6X1008C2D-BF70 K6X1008C2D-BF70 - 128Kx8 70ns Low Power CMOS SRAM | Samsung

K6X1008C2D-BF70 - 128Kx8 70ns Low Power CMOS SRAM | Samsung

K6X1008C2D-BF70 Nrnd
Samsung Electronics
K6X1008C2D-GF70 K6X1008C2D-GF70 - 1Mbit 70ns 32-SOP Low Power SRAM | Samsung

K6X1008C2D-GF70 - 1Mbit 70ns 32-SOP Low Power SRAM | Samsung

K6X1008C2D-GF70 Obsolete

Spezifikationsvergleich

Parameter K6X1008C2D-BF70 K6X1008C2D-GF70
Marke Samsung Electronics Samsung Electronics
Kategorie Memory ICs Memory ICs
Lebenszyklusstatus NRND Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $1,28 $1,30
Speichertyp Volatile SRAM (asynchronous, static) Asynchronous SRAM (CMOS, Low Power)
Memory Organization 128K x 8 (1 Mbit total) —
Number of Words 131,072 —
Bits per Word 8 —
Access Time 70 ns —
Supply Voltage (VCC) [DATA_NEEDED: VCC range] —
Schnittstellentyp Parallel, asynchronous —
I/O Compatibility TTL-compatible —
Operating Mode Fully static (no clock, no refresh) —
Package Type 32-SOP-525 (PDSO32) —
Speed Grade Suffix BF70 (= 70 ns) —
Betriebstemperaturbereich [DATA_NEEDED: temperature grade] Commercial (I) / Automotive (a) - per ordering code
Active Supply Current (ICC) [DATA_NEEDED: ICC max] —
CMOS Standby Current (ICC2) [DATA_NEEDED: ICC2 max] —
Output Enable (OE) Pin Yes (three-state outputs) —
Write Enable (WE) Pin Yes —
Chip Enable (CE) Pin Yes —
Lead-Free Finish Yes (per datasheet revision history) —
Montageart Surface Mount Surface Mount
Process Technology Low-power CMOS Samsung full CMOS (6T cell)
Memory Density — 1 Mbit (128K x 8)
Speicherorganisation — 128K x 8
Access Time (tAA) — 70 ns
Operating Voltage (Vcc) — 4.5 V to 5.5 V
Operating Current (Icc) — 35 mA
Data Retention Voltage — [DATA_NEEDED: data retention voltage minimum VccDR]
Data Retention Current — [DATA_NEEDED: data retention current at 3 V / 2 V]
Gehäuse — 32-SOP (PDSO32, 0.525 inch, plastic)
Schnittstelle — Parallel, asynchronous
Ausgangstyp — Three-state bidirectional
Input/Output Logic — TTL-compatible
MSL-Level — [DATA_NEEDED: MSL moisture sensitivity level]
RoHS-Status — [DATA_NEEDED: RoHS compliance status from manufacturer]
Standby Mode — Chip Enable (CE) controlled

Datenblätter & Ressourcen

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